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    Senior Package Design Engineer - Boise, United States - Idaho State Job Bank

    Idaho State Job Bank
    Idaho State Job Bank Boise, United States

    3 weeks ago

    Idaho State Job Bank background
    Description
    Senior Package Design Engineer at Micron Technology, Inc.

    in Boise, Idaho, United States Job Description Our vision is to transform how the world uses information to enrich life for all .

    Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

    Are you enthusiastic about semiconductor package design and would you enjoy being part of a global team of experts? Then apply for the Senior Package Design Engineer position in the Global Design, Simulation, and Substrate team at Micron Technology.

    You will collaborate with global multi-functional teams to provide innovative DRAM package design solutions for various applications such as Mobile, Edge/Cloud Computing, Automotive, Artificial Intelligence, and Data Center.

    Deliver design activities on time and ensure that design outputs meet Assembly and vendor specifications for High Volume Manufacturing (HVM).

    Join global multi-functional teams, including internal assembly sites, and external subcontractors, to deliver package designs optimized for requirements such as electrical (signal and power integrity), mechanical (warpage, package strength), thermal, and reliability requirements for high-speed interfaces.

    The results include substrate design databases, package stack-up, routing studies, substrate layout, wire bond diagrams, simulation, and other design documentation.

    Collaborate with engineering teams
    • Technology Development (TD), Package Architecture, and key customers in defining next generation packaging solutions and recommend design rules and capability advancements required to productize solutions as roadmap offerings.
    Responsibilities include, but are not limited to the following:
    + Support die padlog layout/optimization. + Support design of highly integrated packages using advanced BEOL and RDL flows for optimal electrical performance, manufacturability, and reliability. Work with customers, internal process design teams, OSATs, and other ecosystem partners. + Support set up of designs, rules, and routing methodologies for advanced processes. + Support package and DFMEA reviews with assembly engineering and subcon teams. + Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings. + Work with SBT (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to To view full details and how to apply, please login or create a Job Seeker account
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