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    Package Design Engineer - Boise, United States - Micron Technology

    Micron Technology
    Micron Technology Boise, United States

    3 weeks ago

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    Description
    Our vision is to transform how the world uses information to enrich life for all.

    Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

    Join the Global Design, Simulation, and Substrate team at Micron Technology as a Package Design Engineer and help us create innovative package designs for advanced semiconductor devices such as DRAM/LPDDR, NAND, and ASIC.

    You will collaborate with a global cross-functional team to optimize package designs for electrical performance, considering high speed interfaces, power integrity, and thermal aspects.

    You will deliver design activities on time and ensure that design outputs meet Assembly and vendor specifications.

    Responsibilities include the following, but are not limited to:
    Semiconductor-to
    • Package Codesign Coordination and ManagementWork closely with architects, semiconductor design leads and package design leads from the initial stages of chip development to optimize die floorplan, interconnection scheme, and package designs for the best system performance.
    Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.

    Engage with key Business Unit stakeholders and assembly subcontractor partners to propose package solutions that meet customer and/or market needs.

    Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
    Track and drive program milestones to ensure timely development execution.
    Support packaging IP (Intellectual Property) development.
    Provide design support for thermal/mechanical/electrical simulation analysis.

    Support and contribute to the design group's continuous improvement efforts such as:
    Global design alignment activitiesPackage design rules and system developmentPackage roadmapsCompetitive Analysis reviewPackage DesignsSupport die padslog layout/optimization.
    Support design of highly integrated packages using advanced BEOL and RDL flows for optimal electrical performance, manufacturability, and reliability. Work with customers, internal process design teams, OSATs, and other ecosystem partners.
    Support set up of designs, rules, and routing methodologies for advanced processes.
    Support package and DFMEA reviews with assembly engineering and subcon teams.
    Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.

    QualificationsIf you have a passion for engineering and want to join a dynamic team that works on innovative semiconductor packaging solutions, this is the opportunity for you.

    We are looking for a qualified engineer with the following skills and experience:

    A master's or doctorate in electrical engineering (preferred) or a related field that covers a wide range of topics in mechanical engineering, materials science, or other interdisciplinary areas.

    At least one year of industry or academic experience in semiconductor packaging is preferred in the areas of substrate design, PCB (Printed Circuit Board) design, signal and power integrity analysis, Cadence and AutoCAD tools, assembly process and materials, product engineering, quality, and reliability.

    Excellent computer skills and proficiency in MS Office.
    A keen eye for detail and accuracy.
    Effective communication skills, both oral and written.
    Ability to work well with others in a team environment.
    Advanced knowledge of electrical circuits and how to read and interpret drawings and schematics.
    Ability to prioritize and manage multiple projects effectively.
    Willingness to travel as required.
    If you meet these qualifications and are excited about working on innovative semiconductor packaging projects, please apply today.

    We look forward to hearing from youAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.

    Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.

    We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.

    Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.

    Additionally, Micron benefits include a robust paid time-off program and paid holidays.

    For additional information regarding the Benefit programs available, please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer.

    All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

    To learn about your right to work click here.

    To learn more about Micron, please visit US Sites Only:
    To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at or select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

    Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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