Package Design Engineer - Boise, United States - Idaho State Job Bank

Description

Package Design Engineer at Micron Technology, Inc.

in Boise, Idaho, United States Job Description Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Join the Global Design, Simulation, and Substrate team at Micron Technology as a Package Design Engineer and help us create innovative package designs for advanced semiconductor devices such as DRAM/LPDDR, NAND, and ASIC.

You will collaborate with a global cross-functional team to optimize package designs for electrical performance, considering high speed interfaces, power integrity, and thermal aspects.

You will deliver design activities on time and ensure that design outputs meet Assembly and vendor specifications.

Responsibilities include the following, but are not limited to:
Semiconductor-to

• Package Codesign Coordination and Management + Work closely with architects, semiconductor design leads and package design leads from the initial stages of chip development to optimize die floorplan, interconnection scheme, and package designs for the best system performance.

+ Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.

+ Engage with key Business Unit stakeholders and assembly subcontractor partners to propose package solutions that meet customer and/or market needs.

+ Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities. + Track and drive program milestones to ensure timely development execution. + Support packaging IP (Intellectual Property) development. + Provide design support for thermal/mechanical/electrical simulation analysis.

• Support and contribute to the design group's continuous improvement efforts such as:

+ Global design alignment activities + Package design rules and system development + Package roadmaps + Competitive Analysis review Package Designs + Support die padslog layout/optimization. + Support design of highly integrated packages using advanced BEOL and RDL flows for optimal electrical performance, manufacturability, and reliability. Work with customers, internal process design teams, OSATs, and other ecosystem partners. + Support set up of designs, rules, and routing methodologies for advanced processes. + Support package and DFMEA review To view full details and how to apply, please login or create a Job Seeker account