Sr. Manager, Flip-Chip CSP Product Management - Tempe, United States - TECHSTAFF of AZ

TECHSTAFF of AZ Tempe, United States

4 days ago

Description

Position Summary

TECHSTAFF is currently looking to fill a Product Management position for the Advanced Packaging Flip-Chip Business Unit in Tempe, AZ.

The primary functions of this position are to develop robust Flip-Chip product assembly engineering services and drive profitable business growth for your assigned customer base.

This will be performed by multi functional collaboration across the Worldwide team, as well as direct project management with the company's customers.

This individual will manage multiple concurrent programs, projects, and assignments within a product engineering and business management scope.

This role requires a high level of self-drive, decisive action, collaboration, ownership and accountability, within a strong team focused environment.

Essential Duties And Responsibilities

This role supports multiple aspects of enabling business growth for advanced flip-chip product technologies (fcCSP laminate strip-based packaging devices).

Foster and maintain key customer relationships with both package engineering and business groups to grow revenue and market share .

Work with customers to understand the assembly, reliability and scheduling requirements for various package qualifications, which may include substrate design, silicon to package interconnects, product assembly material selections, and manufacturing process requirements.

Work with local and overseas factory engineers to understand and characterize package-silicon interactions to be identified during prototype builds, qualifications and production ramps.

This will include working collaboratively to help define experiments, analyze data and support the root cause analysis and corrective action process.

Assist with creating detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.

Create and maintain detailed cost analysis on package types, process flows, and customer product assembly RFQs. Provide detailed pricing proposals to Management and Sales on HVM products and customer package engineering program activities.
Work with advanced product development teams on the transfer of new packaging technologies to production.

This will include supporting cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp.

Develop and discuss with management, strategies for business growth in regard to pricing, business negotiations, technology offerings, competitive landscape, market directions, customer interactions and needs.

Required Qualifications

This position requires at least a Bachelor's Degree in related Engineering field (Mechanical, Chemical, Material Science, Electrical engineering or other relevant discipline).

Minimum of 7-years' experience in the semiconductor industry or other multi-national manufacturing. Previous product management is a plus.
Exhibit organized technical experience and the ability to multiplex across numerous projects and teams is essential. Experience working with offshore factories is a plus.
Demonstrated self-drive and motivation to adapt and overcome obstacles across a multi-faceted, dynamic, and fast-paced role.
Requires excellent, demonstrated written and verbal communication skills.
In-Person (on-site, at-customer) and frequent teleconference technical presentations to customers will be required.
Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required.
This position can require approximately 15% domestic and 10% international travel.

Preferred Qualifications

Flip-chip package design experience. (laminate substrate, advanced packaging for assembly, silicon and componentry on substrate capabilities).
Knowledge of semiconductor packaging materials and manufacturing methods for various flip-chip package form factors.
Knowledge of material and package characterization data analysis, reliability test methods and qualification procedures.
Experience / knowledge of flip-chip packaging failure analysis methods.
Experience with cost modeling, pricing, quoting, and negotiation activities.
Familiarity with Design of Experiments and Statistical Process Control, as well as JMP software use.
Project management certifications and proven experience would be beneficial.

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