- Designing and executing experiments for next-generation Embedded Multi-die Interconnect Bridge (EMIB) products.
- Defining and establishing process recipes, flows, characterization windows, and specifications for new products.
- Collaborating with Technology Development (TD) process engineering module teams to select necessary equipment to develop new devices or products.
- Working with upstream and downstream customers to fulfill product requests, develop design rules, and manage interactions while ensuring manufacturing and reliability goals can be achieved.
- Planning and conducting experiments and data analysis to optimize and characterize new processes and understand sources of variation within the fab to enhance process stability/capability.
- Providing solutions to issues using formal education, statistical knowledge, experiment design, industry literature, and problem-solving tools.
- Devising strategies to tackle challenging problems and putting systems in place to address these problems in the future.
- Exceptional communication skills and a demonstrated readiness to collaborate across organizational boundaries to meet objectives and key results, fostering a stimulating and positive work environment.
- A proven track record of leading process integration and module engineering co-development.
- High tolerance for ambiguity, showing flexibility and adaptability in a dynamic environment.
- Established problem-solving skills with creativity and innovative thinking, as well as forward-thinking and strategic planning abilities.
- A Bachelor's degree in Engineering, Computer Science, or Device Physics (a higher technical degree is highly preferred) coupled with demonstrated progression in technical leadership roles in technology development, and at least 5 years of experience in semiconductor process development and manufacturing.
- A minimum of 3 years of extensive technical expertise and experience in fab interconnect/middle of line/back end of line (BEOL) integration development.
- Over 5 years of leading technical teams and task forces, driving them to successful outcomes and mentoring others in resolving technical challenges.
- A Master's or Ph.D. degree in Engineering, Computer Science, or Device Physics.
- Experience in Embedded Silicon Bridge process integration.
- A demonstrated track record in process development, transfer, and startup.
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NM EMIB Process Integration Yield/Device Development Engineer - Algodones, United States - INTEL
Description
Job Description
With the ever-growing diverse integration landscape to facilitate 2.5D/3D connectivity solutions, the Embedded Silicon Bridge Process Development team is excited to announce an opening for a new Process Integration Yield/Device Development Engineer.
As a Process Integration Yield/Device Development Engineer, you will be responsible for, but not limited to:
The ideal candidate should demonstrate the following behavioral characteristics:
This role requires on-site presence in Rio Rancho, NM. A minimum of six months of on-site work is mandatory before transitioning to a hybrid work model.
Relocation assistance will be provided.
Qualifications
You need to meet the following minimum qualifications to be initially considered for this position. Preferred qualifications are additional to the minimum requirements and are considered advantageous in identifying top candidates.
Minimum Qualifications:
Preferred Qualifications:
Inside this Business Group
As the leading chip manufacturer globally, Intel is dedicated to ensuring every aspect of semiconductor manufacturing is cutting-edge — from semiconductor process development and manufacturing, through yield enhancement to packaging, final testing and optimization, and delivering top-notch Supply Chain and facilities support. Team members in the Technology Development and Manufacturing Group are part of a global network of design, development, manufacturing, and assembly/test facilities, all committed to leveraging the potential of Moore's Law to bring intelligent, connected devices to people worldwide.Posting Statement
All suitable candidates will be considered for employment without regard to race, color, religion, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, or sexual orientation, among other characteristics protected by local laws, regulations, or ordinances.Benefits
We provide a comprehensive compensation package that stands out in the industry, including competitive pay, stock options, bonuses, as well as benefit programs covering health, retirement, and vacation. Discover more about our Exceptional Benefits here.Working Model
This position is eligible for our hybrid work model that enables employees to divide their time between on-site work at their designated Intel location and remote work. In specific circumstances, the work model may be adjusted to align with business requirements.By submitting your application, you agree to the transmission of your details by beBee to the Employer, serving as the data controller, through the Employer's data processor SonicJobs.
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