F9 WLA Process Integration and Yield Engineering Manager - Algodones, United States - INTEL

Description

Job Description

Are you passionate about contributing to Intel's mission to advance Moore's law for the upcoming 50 years? Do you thrive in fostering personal growth and driving the transformation of teams and organizations? If so, look no further than The New Mexico Disaggregation Manufacturing Organization (NM DMO).

The NM DMO is currently experiencing significant growth and evolution. As global compute needs continue to progress, advanced packaging has emerged as a crucial element of the semiconductor industry's roadmap. NM DMO is bringing Advanced Packaging and Foveros HVM to life within a unified organization, with all process segments co-located at a single campus for the first time.
As we expand, we are seeking exceptional individuals with expertise in HVM, foundry, and customer service at both local and global levels. Join us in shaping the next era of technologies that will influence the future for decades to come.

As a **Process Integration and Yield Engineering Manager**, you will oversee a team of Wafer Level Assembly (WLA) process integration/yield engineers. Your role will involve driving activities to enhance yield, defect, and quality to meet objectives. The responsibilities include, but are not limited to:

• Proactively identifying risks and opportunities by leveraging a deep understanding of process flow, product architecture, interactions, equipment, and thorough industry research.
• Supervising the local change control process and review board.
• Leading a team capable of effectively analyzing process flow, electrical/test data, and physical FA to develop comprehensive physical models and risk assessments across technologies.
• Rapidly addressing factory excursions, pinpointing root causes, and implementing solutions that tackle the underlying issues, proactively applying these solutions to other modules.
• Managing excursion processes and demonstrating leadership during significant material review boards.
• Collaborating with internal and external stakeholders to recognize, evaluate, and mitigate quality risks.
• Keeping abreast of new technologies and innovative foundry yield characterization techniques as necessary.
• Engaging in technical discussions with internal and external customers.
• Partnering with the Technology Development (TD) team to create and transfer robust technologies to HVM.
• Developing and executing crucial program and technology roadmaps to ensure top-notch cost-effective products.

The ideal candidate would demonstrate the following behavioral characteristics:

• Strong technical and problem-solving skills.
• Effective verbal and written communication abilities.
• Proven track record of thriving in a high-performance team environment with excellent teamwork, leadership, problem-solving, and prioritization skills.
• Both collaborative and critical mindset.
• Ability to present information clearly to diverse audiences with varying technical backgrounds.
• Capable of working autonomously with minimal supervision.

Relocation assistance is provided.

Qualifications

Applicants must meet the minimum qualifications below to be considered for this position. Preferred qualifications go beyond the minimum requirements and are considered advantageous in identifying top candidates.

Minimum Qualifications:

Candidates must have one of the following 3 degrees, in addition to the specified years of experience in the relevant areas:

• Bachelor's degree in Engineering or Physics, Electrical Engineering, or a related field with 6+ years of experience.
• Master's degree in Engineering or Physics, Electrical Engineering, or a related field with 4+ years of experience.
• PhD in Engineering or Physics, Electrical Engineering, or a related field with 2+ years of experience.
• 5+ years of Semiconductor fabrication (or packaging) experience.
• 2+ years of collaboration experience in defect inspection, failure analysis, integration, and module engineering.
• 2+ years of experience with statistical analysis tools such as JMP and interpreting product data.

Preferred Qualifications:

• 3+ years of management experience.
• Experience in new semiconductor technology development.
• Proficiency in data analysis and statistical process control tools.
• Understanding of semiconductor process flow and related concepts.
• Demonstrated leadership in factory-level projects and timely project execution.
• Familiarity with inline inspection methods, electrical test structures, and SORT programs.

Inside this Business Group

As the leading chip manufacturer globally, Intel is committed to ensuring that every aspect of semiconductor manufacturing remains cutting-edge, from development and manufacturing to yield enhancement, packaging, final testing, optimization, and superior Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group form part of a vast network of facilities dedicated to leveraging Moore's Law to introduce smart, connected devices to people worldwide.

Posting Statement

All qualified candidates will be considered for employment without regard to various factors, in compliance with local laws.

Benefits

We provide a comprehensive compensation package that stands out in the industry, offering competitive pay, stock options, bonuses, as well as health, retirement, and vacation benefits. Discover more about our Exceptional Benefits here.

Working Model

This position is eligible for our hybrid work model, allowing employees to split their time between on-site work at the designated Intel site and remote work. In some cases, the work model may be adjusted to meet business requirements.