- Collaborating across various orgs to develop fab processes meeting overall AP Program needs.
- Driving fab process readiness activities from concept to HVM ready milestones.
- Understanding fab processing interactions with assembly processes to enhance overall development cadence.
- Coordinating resourcing to ensure program milestones meet development timelines.
- Developing roadmaps to fulfill new technology requirements.
- Clear communication across different levels.
- Ability to drive cross-organizational teams to deliver program goals.
- Drive solutions to technology challenges while meeting program deliverables.
- Creativity and flexibility in addressing AP challenges through collaboration.
- Developing individuals, managers, and teams to support Intel's AP roadmaps.
- Prior experience as a Process Champion or Program Manager.
- Prior experience in Assembly and Fab process development/integration.
EMIB Technology Development Process Champion - Algodones, United States - INTEL
Description
Job Description
Intel's Advanced Packaging (AP) technologies drive Moore's Law, aiming to achieve a trillion transistors in a package by 2030. With decades of experience, Intel leads in advanced packaging innovations like EMIB (embedded multi-die interconnect bridge) and Foveros, enabling multiple chips to be connected side by side (EMIB) or stacked on top of one another in a 3D fashion (Foveros).
The Disaggregated Manufacturing Organization (DMO) focuses on fab processes for Foveros base silicon interposer and embedded multi-die interconnect silicon bridge (EMIB) architectures to support internal and Foundry AP future roadmaps.
The DMO EMIB/Silicon Interposer TD Process Champion acts as the interface between the DMO TD Org and Process Module Teams in Fab/Assembly to achieve TD Program Deliverables.
Responsibilities include:
The ideal candidate will exhibit:
Qualifications
Minimum Qualifications
Masters in Engineering, Physics, EE, Chemistry, or Material Science.
15+ years experience in semiconductor process development or integration.
Preferred Qualifications:
PhD in Engineering, Physics, EE, Chemistry, or Material Science.
10+ years experience in semiconductor process development as a process engineer, integrator, or program manager.
Inside this Business Group
Intel is the largest chip manufacturer globally, focused on cutting-edge semiconductor manufacturing. Employees are part of a network across design, development, manufacturing, and assembly/test facilities, all aiming to bring smart devices worldwide.
Posting Statement
All applicants will be considered without regard to various characteristics under local laws.
Benefits
We offer a compensation package with competitive pay, stock, bonuses, and benefit programs covering health, retirement, and vacation.
Working Model
The role is eligible for a hybrid work model, allowing on-site and off-site work. In specific cases, the work model may change to meet business needs.
We maintain a Position of TrustThis role requires passing an extended Background Investigation, including education, SEC sanctions, and criminal/civil checks. For internal candidates, the investigation may occur post-hiring.