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    Senior Engineer, Packaging - San Jose, United States - Conductor

    Conductor
    Conductor San Jose, United States

    3 weeks ago

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    Description
    What You'll Do


    Semiconductor Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

    Mission of the Packaging Solutions Center is to find package solutions beyond Silicon to make next performance systems considering power and cost and to tackle the difficult and hugely innovative task with the industry, focusing on Advanced Packages such as 2.5D, 3D, and 3.5D.


    As a Packaging Engineer, you will participate in Samsung's High-end Advanced Packages, mainly, Design and Electrical Analysis (SI/PI) for high bandwidth and low power Advanced Packaging (ex: SiP, 2.5D, 3D, 3.5D, etc.).


    This position requires someone comfortable with the many aspects of advanced packaging, and who enjoys the challenge of leading integration driven innovations across geographically disperse teams in pursuit of taking advantage of Advanced Packaging.


    Location :
    Onsite at our San Jose office/headquarters 5 days a week with an average of 10% travel per year

    Reports to:
    Corp Executive VP, Packaging Development

    Job #: 41542

    Understand emerging customer architectures through close collaboration with customers and segment marketing leads.

    Deeply analyze the competitive landscape- roadmaps, specifications for competing technologies and the pros/cons vs. Samsung's offerings.

    Define technology portfolio and roadmaps for Samsung advanced packaging offerings.

    Specify technical requirements for each packaging technology with market needs and future insight.

    Evangelize PKG solutions to customers and at conferences.


    Enable customers' designs through close collaboration with the customer to understand requirements, and with design and packaging (engineering & planning) teams in Korea to bring the customer designs to reality.

    Jointly justifies and initiates pathfinding and technology developments.

    Complete other responsibilities as assigned.

    What You Bring


    Bachelors in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 5+ years of experience or Masters in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 3+ Years of Industry Experience or PhD in Electrical Engineering, Mechanical Engineering, Materials Science or Physics with 0+ yrs of Industry Experience Preferred.


    Semiconductor packaging experience in and engineering, marketing, or product planning function at a leading IDM, foundry, OSAT or fabless product company.

    Experience defining roadmaps and writing market & product requirement documents.

    Strategic thinking to draw insights from analysis and drive action. Excellent communication, inter-personal and presentation skills

    You're inclusive, adapting your style to the situation and diverse global norms of our people.

    An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.

    You're collaborative, building relationships, humbly offering support and openly welcoming approaches.

    Innovative and creative, you proactively explore new ideas and adapt quickly to change.

    #LI-MD1

    #J-18808-Ljbffr
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