Ic packaging engineer jobs in United States

We are looking for a highly skilled and motivated IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit (IC) packaging solutions. In this role, you'll play a critical part in enabling high-reliability, high-performance elect ...

Seeking an IC Packaging Engineer to lead the development and delivery of advanced multi-chip packaging solutions for THz-system RFIC soC and high-speed digital applications.This high-impact role combines technical leadership hands-on package design collaboration with OSATs on foc ...

We are looking for a highly skilled and motivated IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit (IC) packaging solutions. · Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wa ...

Immediate need for a talented IC Packaging Engineer. · ...

This well-funded start-up is building a new class of high-resolution perception sensing technology for ADAS and autonomous driving. · ...

This is a 12+months contract opportunity for an IC Packaging Engineer. The position involves semiconductor IC or module packaging, especially on Camera Module or related processes. · ...

Immediate need for a talented IC Packaging Engineer. · ...

We are looking for a highly skilled and motivated IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit (IC) packaging solutions. · Design, develop, and qualify IC packaging technologies including flip-chip,wire bonding,wafe ...

Akoustis is now operating as a wholly owned subsidiary of SpaceX, providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary and connecting the world through Starlink. · We design, build, launch, · and opera ...

This position is responsible for providing leadership while executing inventory transactions inside the Packaging Room. In addition, this position actively engages in daily operations and is engaged in supporting policies and procedures in accordance with the company Vision, and ...

This position is responsible for providing leadership while executing inventory transactions inside the Packaging Room. · ...

This position is responsible for providing leadership while executing inventory transactions inside the Packaging Room. In addition, this position actively engages in daily operations and is engaged in supporting policies and procedures in accordance with the company Vision, and ...

Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup environment. · Serve as technical authority for IC and SiP packaging across multiple produc ...

Claros Technologies is seeking an IC Package Layout Engineer to design and develop advanced IC package substrates for high-performance semiconductor products. · ...

+Job summary · Client is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup environment. · +ResponsibilitiesServe as technical authority for IC and SiP packaging ac ...

We are looking to hire a Lead IC Packaging Engineer for advanced multi-chip packaging solutions - integrating THz-system RFIC, SoC, and high-speed digital chiplets into a single system. · ...

Axiado is an AI-enhanced security processor company redefining the control and management of every digital system. · Serve as technical authority for IC and SiP packaging across multiple products and programs. · Own package architecture and technology roadmap, aligned with produc ...

Claros is innovating at the intersection of power and compute to make AI more sustainable. IC Package Design Engineer will design develop and optimize advanced IC package substrates for high-performance semiconductor products. · Design and route complete IC packages including sta ...

Minimum qualifications: · Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience. · Experience in chip package substrate layout, optimization, design verification, DFM and taping out for producti ...

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? · Envision what you could do here At Apple, · we believe new ideas have a way of becoming · ...