Senior IC Packaging Engineer - San Jose

This is an exciting opportunity to work with a semiconductor startup that has raised over $100m in funding and is rapidly growing. · This role involves working on mechanical designs for advanced electronic packaging and optical components. ...

We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. · ...

This is an exciting opportunity to work with a semiconductor startup that has raised over $100m in funding and is rapidly growing. · Work on mechanical designs for advanced electronic packaging and optical components. · ...

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. · The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, · with a solid understanding of substrate manufacturing and a ...

The job duties include new product introduction NPI: New product package development from design through qualification up to release of the product to production. Development of new module package technologies working closely with the product design engineers and the factories. B ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages. · Overall design responsibility for ASIC package designs. · ...

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise an ...

This well-funded start-up is building a new class of high-resolution perception sensing technology for ADAS and autonomous driving. · ...

Seeking an IC Packaging Engineer to lead the development and delivery of advanced multi-chip packaging solutions for THz-system RFIC soC and high-speed digital applications.This high-impact role combines technical leadership hands-on package design collaboration with OSATs on foc ...

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, · Bachelor's or Master's degree in Electrical Engineering, Elec ...

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. · As a member of our packaging team, you'll have the chance to interact with many product groups and functions.You'll have high visibility on your projects, ...

As a Package Design Engineer at Advanced Technology Search, you'll play a key role in developing high-performance package designs for industry-leading ASICs. These designs feature complex flip-chip-BGA packages with high-speed SerDes and RF/microwave communications A/D D/A conver ...

Description · Change the world. Love your job. · The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist.  As a member of our packaging team, you'll have the chance to interact with many product groups and functio ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages. · Overall design responsibility for ASIC package designs. · Package Design of critical structures for SerDes, ADC/DAC, DDR etc. · ...

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise an ...

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, with a solid understanding of substrate manufacturing and assem ...

We are now looking for a Package Design Engineer in the Advanced Technology Group (ATG). · NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative solutions to extraordinary problems in a wide ra ...

We are now looking for a Package Design Engineer in the Advanced Technology Group (ATG). · NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative solutions to extraordinary problems in a wide ra ...

· Salary: $ 170,000.00 · We have partnered with a semiconductor manufacturing firm in the San Jose, CA area to provide them with a Senior Staff Packaging Engineer. Please review the below description and let us know if you are interested. · Prioritized Must Have Skills for the ...

About Analog Devices is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. · Develop new product package development from design through qualification up to release of the product to production. · Work close ...

Overview · Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose, CA. In this role, you will be working with some of the brightest inventors an ...