Engineer, Semi Packaging Engineering - San Jose

This well-funded start-up is building high-resolution perception sensing technology for ADAS and autonomous driving. · Seeking an IC Packaging Engineer to lead development of advanced multi-chip packaging solutions. · ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages. · Overall design responsibility for ASIC package designs. · Package Design of critical structures for SerDes, ADC/DAC, DDR etc. · ...

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. · As a member of our packaging team, you'll have the chance to interact with many product groups and functions.You'll have high visibility on your projects, ...

This well-funded start-up is building a new class of high-resolution perception sensing technology for ADAS and autonomous driving. · ...

Seeking an IC Packaging Engineer to lead the development and delivery of advanced multi-chip packaging solutions for THz-system RFIC soC and high-speed digital applications.This high-impact role combines technical leadership hands-on package design collaboration with OSATs on foc ...

This is an exciting opportunity to work with a semiconductor startup that has raised over $100m in funding and is rapidly growing. · This role involves working on mechanical designs for advanced electronic packaging and optical components. ...

We are seeking a Packaging Engineer to join our team. · You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.The candidate must understand market trends & end equipment system requirements ...

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. · The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, · with a solid understanding of substrate manufacturing and a ...

This is an exciting opportunity to work with a semiconductor startup that has raised over $100m in funding and is rapidly growing. · Work on mechanical designs for advanced electronic packaging and optical components. · ...

We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. · ...

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. As a member of our packaging team, you'll have the chance to interact with many product groups and functions. · Lead the definition, development and realiza ...

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, · Bachelor's or Master's degree in Electrical Engineering, Elec ...

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, with a solid understanding of substrate manufacturing and assem ...

About Analog Devices is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. · Develop new product package development from design through qualification up to release of the product to production. · Work close ...

We are seeking a Mechanical Engineer focused on Packaging Systems to design, prototype, and validate all physical packaging that interacts with our robot and its ecosystem. · Design packaging systems and shipping enclosures for the humanoid robot, accessories, batteries, and tool ...

We are seeking a Mechanical Engineer focused on Packaging Systems to design, prototype, and validate all physical packaging that interacts with our robot and its ecosystem. · The goal of the company is to ship humanoid robots with human level intelligence. Its robots are engineer ...

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. · Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultr ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America.We're looking for innovative minds to join our mission of shaping the future of technology. At SK hynix America, you'll be part of a team that's pioneering breakth ...

· As a Lead Package Design Engineer you will take ownership of package design and layout for our portfolio of connectivity products deployed by the world's leading cloud service providers and server/networking OEMs. · ...

Dice is the leading career destination for tech experts at every stage of their careers. Our client, Technical Link, is seeking a Senior Package Design Engineer to take ownership of package design and layout for connectivity products deployed by cloud service providers and server ...