IC Package Engineer - Bastrop, TX

Only for registered members Bastrop, TX, United States

4 hours ago

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Job summary

We are looking for a highly skilled and motivated IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit (IC) packaging solutions.

Responsibilities

  • Design, develop, and qualify IC packaging technologies including flip-chip,wire bonding,wafers level packaging (WLP), QFN,CSP,and LGA
  • ,
  • Evaluateand selectpackaging materials(substrates,mold compounds,underfills#adhesives) based on thermal,mecanical,and electrical properties
  • ,
  • Drive thermal management strategies within packages,includingsimulation
    and implementationof heat dissipation techniques
  • ,/forqualificationof package designs

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