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    Electronic Failure Analysis Engineer - Redmond, United States - Sigma Design

    Sigma Design
    Sigma Design Redmond, United States

    1 week ago

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    Description
    Electronics Failure Analysis Engineer
    (Contract for Client)

    SIGMADESIGN has collaborated with a consumer electronics company seeking an experienced Electronics Failure Analysis Engineer to join their facility in Redmond, WA. This position is a contract with an expected duration of 12 months with the opportunity to be extended.

    While on contract with SIGMADESIGN, you will be eligible for the following benefits:
    • Choice of multiple options for medical and dental insurance including options with a FSA or HSA
    • 401(k) with up to 4% company match
    • 15-days of accrued PTO and 9 company paid holidays
    • Voluntary benefits: vision, long-term disability, and life insurance
    • Salary: $115,000-140,000/year DOE
    Primary Function:
    The Electronics Failure Analysis Engineer is responsible for electromechanical test creation and execution on customer designed hardware.

    Essential Job Functions - Responsibilities:
    • Conduct method development for electrical fault isolation of component level electronics via TDR, Laser-Thermal (XIVA/OBRICH), MIC, etc.
    • Follow and develop protocols and methodologies for metallurgical sample preparation including potting/cross-sectioning/polishing, dye/pry, de-capping, and plasma etching
    • Analyze circuits and topologies to identify marginal failure root causes
    • Materials characterization including surface profilometry, mechanical testing, and nano-indentation
    Education and Experience: (Knowledge, skills, & abilities)
    • Bachelor's Degree in Electrical Engineering or related technical field or equivalent experience
    • 5+ years experience performing fault isolation (XIVA / TVA / OBIRCH, TDR, or trace probing) on integrated electronic devices
    • 5+ years of experience in metallurgical cross-sectioning, de-capping, ion milling, dye/pry
    • Ability to read schematics, BOMs, and understand PCB layout, and component level data sheets
    • Strong written and verbal English language communication skills.
    • Excellent teamwork/interpersonal skills and the ability to communicate effectively. Demonstrated ability to work collaboratively, both within and outside one's own work group.
    • Demonstrate commitment and adherence to SIGMADESIGN Core Values.
    • Pass a post-offer background verification.
    Preferred Qualifications:
    • Knowledge of integrated electronics fabrication processes and experience with electro-mechanical systems assembly
    • 1+ years experience in analytical and FA techniques, including C-SAM, FIB-SEM, and XRD/XRF
    • Experience with materials relevant to flexible electronic devices, i.e. photo patternable polymeric resins, elastomers, conductors, underfills, encapsulant materials, thermal materials
    Work Environment:
    Standard lab/production environment. Appropriate safety garments (PPE) must be worn. Occasionally may be required to work in environmental conditions that emulate typical user environments in order to facilitate design testing and validation. Occasionally may be required to travel as required to other facilities, clients or suppliers. Must be able to stand and work as long as 12 hours in different positions. Must be able to lift up to 50 pounds unassisted.
    SIGMADESIGN is an Equal Opportunity Employer
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