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    Principal Mechanical Packaging Engineer - Cambridge, United States - Job Juncture

    Job Juncture
    Job Juncture Cambridge, United States

    3 weeks ago

    Default job background
    Description
    Job Description Job description:

    We are seeking senior-level mechanical design engineers focused on electronics packaging.

    The individual in this role will meet the rising need for advanced systems development and packaging to address the challenges involved with highly integrated hardware that meet shrinking form-factors and increasing thermal loads.

    Our packaging engineers leverage state-of-the-art capabilities to design and integrate electronics and microelectronics assemblies including technologies such as System in Package (SiP), Multichip Module (MCM), Chip-on-board (COB) and high density interconnect PCBs.

    Specific responsibilities include:

    Develop solutions to complex, customer-driven problems with limited direction - drive ideation activities for initial system conceptualization, develop system requirements, propose ways forward when customer requirement are unclear or incomplete, and build and test prototype hardware Perform mechanical design and development associated with the physical arrangement of electronic circuits including assembly design, analysis, build, and test Execute the design, tolerance analysis, evaluation, or failure analysis of assigned projects using mechanical design principles Communicate effectively and openly with multi-disciplinary program team members and program leadership, senior management, and sponsors Lead technical teams of 6 or more people to accomplish program goals, developing time/budgetary estimates, and mentoring junior engineers Identify, manage and control technical and schedule risks associated with a design decision and communicate them to project leadership and customers or stakeholders Produce or oversee the production of fully released Technical Data Packages Strong organization, planning and time management skills to achieve program goals

    Required
    Qualifications:

    Bachelor of Science degree with 15+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering Master of Science degree with 10+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering Team player able to work in a fast paced environment with demonstrated ability to handle multiple competing tasks and demands Experience

    designing/directing

    the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques Experience with 3D CAD, specifically CREO and/or Solidworks Experience with design considerations for manufacturability, proper drawing creation, and GD&T principles Experience with fabrication and assembly of prototypes and proof-of-concept models

    Preferred
    Qualifications:

    Experience with machine shop tools and processes, prototyping, and vendor coordination Experience with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high density substrates, rigid-flex designs, and integrated circuit assembly

    Security Clearance:

    Current in-scope TOP SECRET security clearance is required.

    Qualifications:

    Bachelor of Science degree with 15+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering Master of Science degree with 10+ years of experience in a relevant field such as mechanical engineering, materials science, or manufacturing engineering Team player able to work in a fast paced environment with demonstrated ability to handle multiple competing tasks and demands Experience

    designing/directing

    the physical layout of electrical circuits including SMD, interconnect definition, and integrated circuit assembly techniques Experience with 3D CAD, specifically CREO and/or Solidworks Experience with design considerations for manufacturability, proper drawing creation, and GD&T principles Experience with fabrication and assembly of prototypes and proof-of-concept models

    Preferred
    Qualifications:

    Experience with machine shop tools and processes, prototyping, and vendor coordination Experience with materials, fabrication, and assembly techniques associated with printed circuit assemblies including surface mount technology, high density substrates, rigid-flex designs, and integrated circuit assembly

    Security Clearance:

    Current in-scope TOP SECRET security clearance is required.

    Why is This a Great Opportunity:

    We are seeking senior-level mechanical design engineers focused on electronics packaging.

    The individual in this role will meet the rising need for advanced systems development and packaging to address the challenges involved with highly integrated hardware that meet shrinking form-factors and increasing thermal loads.

    Our packaging engineers leverage state-of-the-art capabilities to design and integrate electronics and microelectronics assemblies including technologies such as System in Package (SiP), Multichip Module (MCM), Chip-on-board (COB) and high density interconnect PCBs.

    Salary Type

    :

    Annual Salary

    Salary Min

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    Salary Max

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    US Dollars

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