- Work closely with the electrical and system engineers to design and model complex electronic assemblies involving the integration of PCBs and interconnects with a mechanical enclosure and parts.
- Design electronic enclosures and optimize panel architecture to meet project goals for performance, testability, manufacturability, and cost.
- Research/select connector and interconnect devices based on project requirements and vendor options.
- Apply industry best practices for ruggedized electronics, including but not limited to thermal management, EMC, shock and vibration.
- Create finite element models to simulate load cases and predict structural, fatigue, and dynamic characteristics of new products.
- Perform detailed thermal simulation of electronic assemblies to predict operating temperatures under various conditions. Conduct thermal mitigation tradeoff studies, often involving active and/or forced air cooling.
- Analyze detailed mechanical assembly characteristics, such as bolted joints, tolerance stack ups, and GD&T.
- Prepare and release design documentation (e.g. drawings, calculations, bills of material, and purchase specifications).
- Conduct technical design reviews with internal and external customers
- Support the organization with vendor selection, production launch and PPAP documentation.
- Lead and execute the validation and qualification of new products, components, and assemblies, with focus on mechanical and thermal performance, and electrical functional tests.
- Support multiple work assignments with shifting priorities and quickly pivot design direction as new information arises.
- Bachelor of Science in Mechanical Engineering or related engineering field.
- 10+ years of experience designing mechanical packaging for electronic control and power supply assemblies.
- Proficient in the use of 3D CAD software (preferably Siemens NX CAD / Unigraphics).
- Proficient in simulation tools to perform FEA, stress and thermal analyses of electronic assemblies (e.g. ANSYS, Icepak, CFD).
- Experience with the integration of rigid, flexible and rigi-flex printed circuit boards into mechanical assemblies.
- Familiar with electrical connectors and interconnect methodologies.
- Ability to travel 10% of the time.
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Electronics Packaging Design Engineer - Erie, United States - Matlen Silver
Description
Job Title: Electronics Packaging Design Engineer
Duration: Full-Time/Direct Hire
Location: Erie, PA
Work Schedule: Hybrid (Onsite Tues-Thurs)
Pay Scale: $100,000-154,000/yr
Full Benefits Package: Medical, Dental, Vision Care, 401k, Paid Holiday and PTO Full relocation assistance offered.
Role Summary:
The Packaging Engineer is part of the Electronics Hardware team and is responsible for the mechanical design aspects of power and control electronic products used in locomotives and surface mining trucks. The engineer works with a cross-functional team to integrate complex circuit card assemblies, discrete components, and interconnect devices into a mechanical enclosure design that meets the challenging physical, performance, thermal, and environmental requirements of the project.
Responsibilities:
Minimum Qualifications:
About Matlen Silver
Experience Matters. Let your experience be driven by our experience. For more than 40 years, Matlen Silver has delivered solutions for complex talent and technology needs to Fortune 500 companies and industry leaders. Led by hard work, honesty, and a trusted team of experts, we can say that Matlen Silver technology has created a solutions experience and legacy of success that is the difference in the way the world works.
Matlen Silver is an Equal Opportunity Employer and considers all applicants for all positions without regard to race, color, religion, gender, national origin, age, sexual orientation, veteran status, the presence of a non-job-related medical condition or disability, or any other legally protected status.
If you are a person with a disability needing assistance with the application or at any point in the hiring process, please contact us at email and/or phone at: //
