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    SoC Chip Lead - Austin, United States - NXP Semiconductors N.V.

    NXP Semiconductors N.V.
    NXP Semiconductors N.V. Austin, United States

    4 days ago

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    Description


    • MCU/MPU Engineering team defines and develops System on Chip, ASIC's, Digital and Analog IP's for a wide range of products, including automotive microprocessors, application processors, microcontrollers, and network processors.

    Responsibilities:

    • Lead product execution for Automotive/Consumer/Industrial ASIL-B/D SoC's

    • Work with architects and systems engineering to define the part. Generate and analyze data to take right and cost-effective architecture decision.

    • Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part.

    • Work with IP and SoC functions (front end, verification, AMS, DFT, Physical implementation) to understand and resolve inter/intra functional handoff and challenges.

    • Oversee definition management and make sure the implementation complies with the requirements

    • Work closely with downstream team's dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed

    • Work closely with Test and Product engineering teams to enable productization.
    • Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues.

    • Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects.

    • Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements

    • Mentor engineers across various functions
    Cross functional aspects:

    • This role is primarily about leading cross functional teams

    • During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors

    • During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.

    • Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams.

    • Overall, Chip lead is central design point of contact for all cross functional teams associated with the part.

    Job Qualifications:

    • Bachelor's in engineering with 15 years of design development experience, with at least 5 years of leading complete design and/or design functions.

    • MS in Electrical Engineering preferred (higher level education may substitute for some experience).

    • Experience in leading Global cross functional teams

    • Experience in leading designs in smaller geometries desired

    More information about NXP in the United States...

    NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.
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