- Build and manage a multi-disciplinary team of package designers across multiple locations and with expertise in all different domains: EM, SI/PI, Thermal, and Layout
- Deliver best-in-class IC Packaging solutions for a wide variety of advanced communications SoCs as well as high-speed products. Target applications include 5G radios, data center optical transceivers, microwave backhaul transceivers, network processors, WiFi transceivers, etc
- Manage day-to-day project tasks, make decisions on package design, run simulations to verify performance, and work cross-functionally with Comm. System, AMS, RFIC, and ASIC design teams to guide the technical execution of cutting-edge products from inception to design, test, qualification, and volume production
- Self-motivated with excellent communication skills and the ability to provide leadership in a fast-paced environment
- Experience managing, mentoring, and coaching teams, preferably in a comparable role
- Experience in managing project deadlines and working with teams globally
- Deep understanding of EM and transmission line theory and its application to package and PCB design (s-parameters, Smith Chart, and frequency domain analysis)
- Understanding of package / PCB construction and stack up such as QFN, LGA, FCCSP, FCBGA, and other lead-frame, wire bond, and organic substrates
- Understanding of the material properties used for buildup, core, and laminates
- Experience in RF and/or high-speed packaging and PCB development, qualification, and deployment
- Experience in Power integrity and System-level power architecture specifications, including SERDES channel analyses (e.g., COM analysis, Eye Diagram, Equalization)
- Experience with RF and Signal Integrity Instrumentation: VNA, High-Speed Scope, and TDR
- Experience with Electromagnetic EDA tools and Methodologies (e.g., HFSS, Icepak, SiWave, Clarity, Celsius, ADS, Momentum, etc.)
- Ability to use layout tools such as APD and Allegro PCB Editor
- Ability to write standard operating procedures (SOP) and process-flow documentation
- BS in Electrical Engineering or related + 13 years of experience, or MS + 11 years of experience, or Ph.D. + 8 years of experience
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Director of Package Design Engineering - Carlsbad, United States - MaxLinear
Description
Responsibilities:
MaxLinear is seeking a Director of Package Design Engineering to join our growing team. In this role, you will focus on the following:
MaxLinear has a Total Compensation philosophy which includes base salary and annual discretionary bonus eligibility and many positions also include stock-based compensation.
MaxLinear expects to offer a starting base salary within the range of: $159,500 to $247,595 Annually
We offer competitive benefits designed to support employee health, welfare, and retirement and some highlights are: health care benefits, 401k savings plan, Employee Stock Purchase Plan (ESPP), paid time off, and a hybrid work schedule.
The actual starting base salary will be determined by the match to certain role-related criteria such as educational degree(s) or equivalent, relevant work experience, skillset needed for the role, and geographic location; this is not an all-inclusive list as some roles may require unique skills or experience.
Qualified applicants will receive consideration for employment without regard to, and will not be discriminated against based on race, sex, religion, national origin, sexual orientation, gender identity, disability, or protected veteran status.
Company Overview:MaxLinear is a global, NASDAQ-traded company (MXL) where the entrepreneurial spirit is alive and well. We are a fabless system-on-chip product company, striving to improve the worlds communication networks for everyone through our highly integrated radio-frequency (RF), analog, digital, and mixed-signal semiconductor solutions for access and connectivity, wired and wireless infrastructure, and industrial and multi-market applications.
We hire the best people in the industry and engage them in some of the most exciting opportunities that connect the world we live in today. Our growth has come from innovative, bold approaches to solving some of the worlds most challenging communication technology problems in the most efficient and effective manner.
MaxLinear began by developing the worlds first high-performance TV tuner chip using standard CMOS process technology. Others said we couldnt achieve the extremely high-performance requirements using CMOS, but we proved them wrong and achieved enduring global market leadership with our designs. Since then, weve developed a full line of products that drive 4G and 5G infrastructure; enable data center, metro and long-haul optical interconnects; bring 10Gbit to the home; power the IoT revolution; and enable robust and reliable communication in harsh industrial environments. Over the years, weve expanded through organic growth and through several acquisitions that have perfectly complemented our existing portfolio and enabled us to deliver complete end-to-end solutions in our target markets. One such example was the acquisition of Intels Home Gateway Platform Division that added Wi-Fi, Ethernet, and Broadband Gateway Processor SoC technology to our connected home portfolio creating a complete and scalable platform of connectivity and access solutions to fully address our customers needs.
Our headquarters are in Carlsbad, near San Diego, California. We also have major design centers in Irvine and San Jose, California; Waltham, Massachusetts; Vancouver, Canada; Valencia, Spain; Bangalore and Chennai, India; Villach, Austria; Munich, Germany; Israel; and Singapore.
We have approximately 1,500 employees, a substantial majority of whom have engineering degrees and include masters and Ph.D. graduates from many of the premiere universities around the world. Our employees thrive on innovation, outstanding execution, outside-the-box thinking, nimbleness, and collaboration. Together, we form a high-energy business team that is focused on building the best and most innovative products on the market.
