- Conceive novel concepts for low-loss and low-cost fiber packaging through optical/mechanical design and
modeling of photonic chip coupling interfaces - Simulate the performance of optical assemblies, with a mind towards the interface between PICs and package,
as well as manufacturing tolerances. - Characterize and qualify the developed packaging solution (optical/mechanical/reliability) with device and
systems engineers. - Work with contract manufacturers to define design rules for manufacturing.
- Document and report to internal members and communicate with external vendors and partners
- BS or above a relevant technical field (Optics, Mechanical, Electrical, Materials Science, Applied Physics, or
similar) - 5+ years of hands-on experience in packaging fiber-coupled devices and photonics integrated circuits chips.
- Experience designing for manufacturability and automated assembly and characterization
- Knowledge of fiber-optical systems and optical polymers
- Experience with 3D printing and/or CNC machining is preferred
- Ability to read and interpret engineering specifications, drawings, manufacturing instructions, and technical
analyses. - Industry experience creating detailed design documentation (specifications, design descriptions, verification,
and testing plans). - Positive - a can-do attitude that helps you rise to challenges
- Collaborative - a team player who can effectively communicate with others
- Attentive to detail - nothing gets by you
- Efficient - a knack for effectively prioritizing tasks and managing your time
- Pride in your work - real desire to do quality work
- Career-minded - looking for more than a job
- Competitive salary
- Stock options
- Medical, dental, and vision insurance
- 401(k) retirement plan
-
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Photonics Packaging Engineer - Santa Clara, United States - DeepSight Technology
Description
DeepSight Technology Inc. is a rapidly growing startup company that has developed breakthrough technology in ultrasound imaging. This new technology will both extend the range and clarity over current systems by 10x - 100x We are setting new standards that will dramatically improve the capabilities of ultrasound for many years. In order to develop and improve this technology, we need dedicated team players on our side. Not only do we offer a great team-oriented environment, but we also offer competitive compensation of $75K to $200K per year and generous benefits in both our Clayton, MO (a suburb of St. Louis) and Santa Clara, CA offices.Job Description
In photonics, the packaging design is as crucial as the photonic integrated circuit (PIC) design. This is especially true when the product interfaces and interacts with the physical world. In this role, as a member of a multi-disciplinary product development team, you will own the packaging development from concept to production for state-of-the-art photonic integrated circuits. You will be also involved in integrating photonics components with other modules in the system. This position will be looking for someone who can design, develop, and validate a low-cost, high-performance, and reliable packaging platform for photonics components and system integration.
Responsibilities include:
We offer great benefits and perks:
