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    Unit Process Engineer - Albany, United States - IBM

    IBM
    IBM Albany, United States

    Found in: Lensa US 4 C2 - 6 days ago

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    Description

    Introduction

    As a Hardware Developer at IBM, you'll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today's market.

    Your Role and Responsibilities

    IBM Research at Albany Nanotech is currently seeking engineers in the area of process technology for semiconductors and related devices, including wafer polishing, wafer grinding, wafer edge trimming with emphasis in wafer bonding and thinning / finishing applications for the integration of various bonding processes such as permanent insulator-insulator wafer bonding, hybrid metal/insulator wafer bonding, temporary adhesive wafer bonding, and wafer debonding process. These process technologies are critical for enablement of applications for 2.5D and 3D integration for chiplet-based integrated circuits, backside power delivery network for transistor powering, and stacking of transistors. The hired candidates will have significant expertise and understanding of the fundamental principles in one or more of these process areas. Some of the job responsibilities include maintaining and qualifying state of the art semiconductor 300mm process equipment and/or developing processes from an early concept stage into a mature element that enables a leading-edge technology.

    Job responsibilities include

    • As an equipment owner, you will be maintaining the health of the equipment by collaborating with equipment vendor, fab operations, process, and management team. To accomplish this, you will be working using web based statistical process control charts, SiView to collect the wafer history and related data, and web-based software to analyze the contamination, particle, and elemental data available from the wafers. A good understanding of the measurement and material analytical techniques is preferred.
    • As process owner, you are expected to assess the process window, formulate design of experiments (DOE's) and make continuous improvement to unstable processes. For process ownership, you will be working with integration team in addition to the above-mentioned teams in (a).
    • As process developer, you are expected to fundamentally understand the process tooling and design experiments to develop new processes for advanced technologies. You will be working with equipment vendors, material vendors, and internally at IBM to drive development for new materials and create data package for implementation of the developed process. You will be supporting the process needs for a join development program (JDP) or joint development alliance (JDA). Constant industry research and the ability to be up-to-date with latest semiconductor equipment advancements is part of this job. The ability and willingness to adapt on changing semiconductor technologies is important in this position. Generation of Intellectual Property for IBM and protection of it through the patenting process are also expected. The hired candidates must possess strong analytical and design-of-experiment knowledge, excellent written and verbal communication skills in English.

    You must be willing to work in Albany, NY, with occasional day travel to Yorktown Heights, NY, and infrequent overnight travel to various locations worldwide. (<10%)

    This position requires a B.S. degree in Chemical or Electrical Engineering, Materials Science or Engineering, Chemistry, Physics, or a related field, with relevant industrial experience preferred.

    Required Technical and Professional Expertise

    • 1) Master's degree in a science or engineering discipline
    • 2) Design of experiments
    • 3) Strong communication and presentation skills, Fluent in English
    • 4) 3+ year of experience with in Semiconductor industry

    Preferred Technical and Professional Expertise

    5+ year of experience with related experience in polishing, grinding, and wafer thinning

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