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    Microelectronics Packaging Engineer - Huntington Beach, United States - Boeing

    BOEING background
    Description
    Microelectronics Packaging Engineer (Mid-Level, Lead or Senior)

    Company:
    The Boeing CompanyJob ID:

    Date Posted:
    Location:USA - Huntington Beach, CA

    Job Description Qualifications:

    The Boeing company is seeking aMicroelectronics Packaging Engineer (Mid-Level, Lead or Senior) to join our team in Huntington Beach, CA.This person will have a strong background in the current SOTA for advance packaging as it relates to microelectronics.

    A successful candidate will lead the innovation and development of novel 2.5D / 3D advanced packaging for high-speed/mixed signal/RF microelectronics applications inclusive of electrical performance of both active and passive elements, thermal-mechanical performance and design for manufactability and reliability.

    Within BR&T, Boeing's Solid State Electronics Development organization (SSED) performs microelectronics technology development and design for aerospace systems.

    We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications, processing, and other electronic systems.

    These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state of the art semiconductor process technologies including CMOS, GaAs, GaN, and SiGe.

    SSED uses external wafer fabrication but performs design (architecture, RTL, synthesis, circuits, physical design, verification, packaging and test) in house.

    SSED has numerous microelectronics projects, funded both by internal Boeing customers and external Government Science and Technology (S&T) customers. SSED's large staff of microelectronics engineers conduct research, design, and test microelectronics hardware in support of these projects.

    You won't be bored in our group Join us and put your passion, determination, and skill to work building the future Position Responsibilities:

    Leads advanced packaging analysis based on system requirements, development of architectural approaches, and detailed specificationsLeads advanced packaging design reviews of testing and analysis activity to assure compliance to program requirementsLeads activities in support of making recommendations for advanced packaging suppliers as well as EDA vendorsCoordinates engineering support throughout the lifecycle of the program productResolves complex issues on critical programs related to advanced packaging approaches, requirements, specifications and designLeads technical aspect of proposal preparation related to advanced packagingIdentifies critical performance metrics and develops processes to mitigate program risks for computing them.

    Demonstrated track record as a self-motived, independent, high-performance team memberExcellent verbal and written communication abilityThis position is expected to be 100% onsite.

    The selected candidate will be required to work onsite at the listed location.
    This position requires the ability to obtain a U.S Security Clearance for which the US Government requires US Citizenship. An interim and/or final US Secret clearance Post Start is required.

    Basic Qualifications (Required Skills/Experience):Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science1+ years of experience in the field of microelectronics packaging including MCM, heterogeneous integration, 3D chip stacking, etcExperience with complex packaging architectures on circuit performance including speed, thermal, etcExperience with SWaP-C constrained electronics developmentExperience with EDA tool flow and vendor supports including but are not limited to chiplets floor-planning, interposer design, SiP optimization, physical simulation, and chiplets assemblyPreferred Qualifications (Desired Skills/Experience):5+ years of related work experience or an equivalent combination of education and experience10+ years of related work experience or an equivalent combination of education and experienceUnderstanding and experience with design, development and testing of advanced packaging techniques.

    This includes conventional packaging techniques like ASIC, BGA, 2.5D / 3D heterogeneous integration, and familiarity with commonly available supply chain for fabrication, assembly, packaging and test of multi-chip-modules (MCMs) and System-in
    • Package (SiP) for digital and RF products.

    Understanding of 3DIC development flow and tools; chip-level and substrate requirements, architecture, design, and verification; foundry interface and fabrication; and final characterization and test including electrical, mechanical and thermal considerations.

    Understanding of commercial microelectronics fabrication process technologies, including standard substrates (organic, silicon and glass) and PCB manufacturing processesHold patents in advanced microelectronics packaging architectures and performance improvementsExperience working building and managing Outsourced Assembly and Test (OSAT) vendor supply chainUnderstand various approaches and come up with strategies to mitigate Known Good Die (KGD) risks and improve functional SiP chip yieldExperience organizing and leading cross-functional engineering teams including internal and external organizationsExperience supporting proposals (technical, cost, and schedule) with advanced microelectronics packaging contentExperience with technical, cost, and schedule managementExperience supporting military programs including engagement with customersActive security clearanceTypical Education/Experience:Mid-Level (Level 3)Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g.

    Bachelor) and typically 5 or more years' related work experience or an equivalent combination of technical education and experience (e.g.

    PhD, Master+3 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

    Lead (Level 4)Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g.

    Bachelor) and typically 9 or more years' related work experience or an equivalent combination of technical education and experience (e.g.

    PhD+4 years' related work experience, Master+7 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.

    Senior (Level 5)Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g.

    Bachelor) and typically 14 or more years' related work experience or an equivalent combination of technical education and experience (e.g.

    PhD+9 years' related work experience, Master+12 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.


    Relocation:
    This position offers relocation based on candidate eligibility

    Drug Free Workplace:
    Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies

    Shift Work Statement:
    This position is for 1st shift.
    At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.

    The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.

    The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.

    Please note that the information shown below is a general guideline only. Pay is based upon candidate experience and qualifications, as well as market and business considerations.

    Summary pay range Mid-Level Level 3:
    $104, $141,450.00Summary pay range Lead Level 4: $126, $171,350.00Summary pay range Senior Level 5: $155, $210,450.00Applications for this position will be accepted until May 10, 2024. BRT_MSABoeing is the world's largest aerospace company and leading manufacturer of commercial airplanes and defense, space and security systems. We are engineers and technicians. Skilled scientists and thinkers. Bold innovators and dreamers. Join us, and you can build something better for yourself, for our customers and for the world.


    Relocation:
    Relocation is available for eligible candidates, if authorized

    Export Control Requirement:
    U

    S Government Export Control Status:
    This position must meet export control compliance requirements. To meet export control compliance requirements, a "U.S. Person" as defined by 22 C.F.R. §120.15 is required. "U.S. Person" includes U.S. Citizen, lawful permanent resident, refugee, or asylee.


    Safety Sensitive:
    This is not a safety sensitive positionContingent Upon Award ProgramThis position is not contingent upon program award

    Experience Level:
    Individual Contributor - 3

    Job Type:
    Regular
    Job Code:6B1DI3 (64Y)

    Equal Employment Opportunity:

    Stay safe from recruitment fraud The only way to apply for a position at Boeing is via our Careers website.

    Learn how to protect yourself from recruitment fraud
    • Recruitment Fraud WarningBoeing is an Equal Opportunity Employer.
    Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.
    Request an Accommodation - Requesting Interview Accommodations Applicant Privacy - Applicant Privacy EEO is the law Poster - EEO is the lawBoeing Policy on EEO - Boeing EEO Policy Affirmative Action and Harassment - Boeing Affirmative Action and Harassment Boeing Participates in E - VerifyEnglish - E-Verify (English) Spanish - E-Verify (Spanish) Right to Work Statement English - Right to Work (English) Spanish - Right to Work (Spanish)


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