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    Backgrind Operator Level 4 - Milpitas, United States - Integra Technologies.

    Integra Technologies.
    Integra Technologies. Milpitas, United States

    3 weeks ago

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    Description

    Job Description

    Job Description

    Integra Technologies is not accepting unsolicited assistance from search firms for this employment opportunity. Please, no phone calls or emails. All resumes submitted by search firms to any employee at Integra Technologies via email, the Internet, or in any form and/or method without a valid written search agreement in place for this position will be deemed the sole property of Integra Technologies. No fee will be paid in the event the candidate is hired by Integra Technologies as a result of the referral or through other means.

    Salary is dependent on experience and education. Swing positions have a 10% differential and Graveyard positions have a 16% differential.

    JOB DESCRIPTION

    Job Code:

    Reports To: Production Manager

    Department Name: 130 – Mfg - Thinning and Polishing

    FLSA Status: Non-exempt

    POSITION SUMMARY

    Perform basic and complex preparation of wafer processing and wafer thinning including but not limited to grinder machine setup, wafer mounting, grinding in different wafer material, thinning individual die, manual mounting and detaping for high bumped wafers.

    KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE

    Level 1:

    • Perform manual back grind tape application and wafer detaping.
    • Perform wafer visual inspection using microscope and magnifying glass.
    • Measure wafer thickness using drop gauge and generate SPC data sheet.
    • Operate SEC mounting system and 8" and 12" Ultron mounting systems.
    • Operate 8"-12" Ultron UV expose systems.
    • Basic operation of grinder machines.
    • Perform grinder machine setup and cleaning.
    • Setup and operate Lintec 3500 Laminator.
    • Understanding the use of EPICOR system.
    • Flexible to perform other duties as assigned.

    Level 2:

    • Evaluate non-bump wafer tape and manually calculate backgrind characterization.
    • Identify backgrind problems and provide solutions.
    • Mount and re-mount 12" wafer.
    • Handling of thin wafer and ultra-thin wafer.
    • Perform DBG and quarter wafer dog ear thinning for 8" and 12" wafer.
    • Perform polishing 6" and 8" wafers.
    • Flexible to perform other duties as assigned.

    Level 3:

    • Perform grinding sapphire, GaAs wafers and metal removal grinding
    • Perform grinding InP wafers and reprocessing wafers
    • Perform individual die thinning and surface mode grinding
    • Be able to evaluate engineering projects, draft work instructions and schedule jobs and tools needed.
    • Provide on-the-job training for level 1 and level 2 operators if needed.
    • Effectively manage workflow, coordinate work among team members and demonstrate leadership and problem solving.
    • Flexible to perform other duties as assigned.
    • Perform polishing 6" and 8" GaAs and bonded wafers.
    • Perform manual backgrind tape application and wafer detaping for high bump wafers.
    • Flexible to perform other duties as assigned.

    Level 4:

    • Proficient in performing full range of all department skills of all levels
    • Perform in the capacity of back up team leader as needed
    • May operate up to three fully automatic machines simultaneously
    • Be able to evaluate engineering projects, draft work instructions and schedule jobs and tools needed.
    • Provide on-the-job training for other levels of operators if needed.
    • Effectively manage workflow, coordinate work among team members and demonstrate leadership and problem-solving.
    • Cooperate with business needs including shift changes and priority changes
    • Flexible to perform other duties as assigned.

    Lead:

    • Serve as back-up team leader and perform operator pass down at shift change.
    • Responsible for inventory, material requests and hands-on job execution to ensure on-time delivery.
    • Verify machine setup and update department schedules.
    • Provide on-the-job training for new operators.
    • Flexible to perform other duties as assigned.

    JOB REQUIREMENTS INCLUDE

    Education: High school diploma or equivalent required.

    Experience: Minimum one to five years of experience with machine operation or semiconductor production test.

    Knowledge/Skills:

    Level 1 and 2:

    • Familiar with applicable machine operation and basic arithmetic operation
    • At least six months experience in wafer thinning and polishing required.
    • Familiar with grinder machines setup and wafer mounting.

    Level 3 and 4:

    • In-depth understanding of blade overall specification and blade process application
    • In-depth understanding of machine parameter

    SUPERVISORY RESPONSIBILITIES

    Total Number of Employees Directly Supervising: _0_

    Number of Subordinate Supervisors Reporting to Position: _0_

    This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified.

    In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).

    PHYSICAL REQUIREMENTS INCLUDE

    In an average workday, employee must (check one frequency for each task):

    Task

    None

    Occasional

    Frequent

    Constant

    Stand

    ☐

    ☐

    ☐

    ☒

    Walk

    ☐

    ☐

    ☐

    ☒

    Sit

    ☐

    ☐

    ☒

    ☐

    Bend/stoop

    ☒

    ☐

    ☐

    ☐

    Climb

    ☐

    ☒

    ☐

    ☐

    Reach above shoulders

    ☐

    ☒

    ☐

    ☐

    Squat/crouch/kneel

    ☐

    ☒

    ☐

    ☐

    Push/pull

    ☐

    ☒

    ☐

    ☐

    Lift

    ☐

    ☒

    ☐

    ☐

    Usual amount

    ☐ <10 lbs

    ☒ 11-25 lbs

    ☐ 26-50 lbs

    ☐ 51+ lbs

    Carry

    ☐

    ☒

    ☐

    ☐

    Usual amount

    ☐ <10 lbs

    ☒ 11-25 lbs

    ☐ 26-50 lbs

    ☐51+ lbs

    Employee must use hands for repetitive action such as (please check all):

    Task

    Right

    Hand

    Left

    Hand

    Simple grasping

    ☒ Yes

    ☐ No

    ☐ Yes

    ☒ No

    Firm grasping

    ☐ Yes

    ☒ No

    ☐ Yes

    ☒ No

    Fine manipulation

    ☒ Yes

    ☐ No

    ☐ Yes

    ☒ No

    WORKING CONDITIONS INCLUDE

    In an average workday, employee is exposed to (check one frequency for each task):

    Task

    None

    Occasional

    Frequent

    Constant

    General shop conditions

    ☐

    ☐

    ☐

    ☒

    General office environment

    ☐

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