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    rf/mmwave packaging engineer - Sunnyvale, United States - Mastech Digital

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    Description
    Mastech Digital provides digital and mainstream technology staff as well as Digital Transformation Services for all American Corporations. We are currently seeking a RF/mmWave Packaging Engineer for our client in the Consulting domain. We value our professionals, providing comprehensive benefits and the opportunity for growth. This is a Permanent position, and the client is looking for someone to start immediately.

    Duration:
    Full-time


    Location:
    Sunnyvale, CA


    Salary:
    $130K-$192K/Annually or $65-$90/Hourly


    Role:
    RF/mmWave Packaging Engineer


    Primary Skills:
    RF/mmWave

    Role Description:
    The RF/mmWave Packaging Engineer must have at least 3+ years of experience.

    Responsibilities:

    • Design, simulate and validate advanced RF/mmWave packaging/module solutions.
    • Liaise with OSAT vendors for manufacturing.
    • Design, simulate and validate Integrated passive device (IPD).
    • Liaise with foundry for tapeout.
    • Design PCB schematic, layout and perform circuit and 3D EM simulation.
    • RF lab debug, tuning, performance optimization and validation.

    Required Skills:

    • 3+ years of experience in developing RF/mmWave packages and IPD design.
    • In depth knowledge in electromagnetics, RF filters, PA and LNA design.
    • Experience with foundry tapeout and working with OSAT vendors.
    • Experience in RF schematics, layouts, and DFM.
    • Experience with RF lab equipment and probe station for device characterization, debug, and component/system performance validation.
    • Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
    • Good communicator and team player.

    Education:

    • MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design

    Preferred Skills:

    • 5+ years of relevant industry experience
    • Familiar with RF system design.
    • Familiar with regulatory requirements (FCC, CE, etc.).

    Education:
    MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design/Bachelors degree in Computer Science, Electrical/Electronic Engineering, Information Technology or another related field or Equivalent

    Experience:
    Minimum 3+ years of experience

    Relocation:
    This position will not cover relocation expenses

    Travel:
    No


    Local Preferred:
    Yes

    Note:
    Must be able to work on a W2 basis (No C2C)

    Recruiter Name:
    Haris Khan


    Recruiter Phone:
    Equal Employment Opportunity

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