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Ocotillo Technology Fabrication Yield Engineer - Phoenix, United States - Taleo BE
Description
Job Details:
Job Description:
Ocotillo Technology Fabrication (OTF) is looking for highly motivated individuals with a strong technical background and capabilities to transfer, ramp, and drive improvement of Intel 7, Intel 18A, and beyond technologies.
Candidates will drive rapid continuous improvements in safety, quality, yield, reliability, cost, process stability/capability, and productivity while maintaining rigorous CE (Copy Exactly).
Integration Engineers use data analysis and a wide range of knowledge from physics, chemistry, material science, and semiconductor device physics to identify and quickly resolve issues arising in the manufacturing process to minimize the impact to defects, yield, and device electrical performance.
Integration Engineers are expected to develop innovative solutions to address key issues impacting the technology:improve process window, address systematic failure modes, deliver against technology yield improvement roadmap, and own mission based teams to address critical issues.
Integration Engineers are also expected to be the technical leaders within the OTF High Volume Manufacturing environment and Intel's Virtual Factory Network.
As an Integration Engineer you will be expected to lead teams of process, yield, and device engineers to deliver best in class yield, performance, and quality.
The position is open for both FEOL (Front End) and BEOL (Back End) segment of the process. Prior industry experience will be taken into account when assigning a segment.Responsibilities may include, but are not limited to:
Owning a process segment of the line and driving metrics for that segment to Best In Class levels.
Lead or support critical activities for yield enhancement, defect reduction, cost reduction, and productivity improvement in partnership with Technology Development and Virtual Factory Peers Transfer and implementation of process changes to maintain CE within the Virtual Factory.
Leading cross functional area teams to resolve excursions in real time.Preparing detailed, clear timely reports summarizing progress and delivering to factory and technology management Develop strong partnerships with Process Module Engineering, Production, Defect Reduction, Device, Yield Analysis, and Product Development Engineering.
The ideal candidate will exhibit the following behavioral traits:Excellent data analysis skills and a passion for problem solving Excellent organizational skills with a strong attention to detail Excellent interpersonal skills with the ability to work with people at all levels.
Excellent communication skills to influence and direct a wide variety of groups across the organization. A positive attitude with willingness to lead.Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your school/ work/ classes/ research and/or current job role within the semiconductor manufacturing environment.
Minimum Requirements:
The candidate must possess a Bachelors, master's or PhD in Electrical Engineering, Microelectronics Engineering, Material Science, Chemical Engineering, Mechanical Engineering, Optical Engineering, Chemistry or Physics.
At the bachelor's level minimum 10 years of experience, at the master's level minimum 7 years of experience, and at PhD level minimum 5 years of experience.
Preferred Qualifications:
Knowledge of statistics and experimental design; and the skills to apply that knowledge to tool matching, tool qualification, and process development.
Experience leading taskforces using a structured problem-solving methodology to resolve process-related problems, quality improvement/tool improvement/ cost improvement actions.
Ability to work across organizational boundaries including process engineering, integration, yield, and production.
Understanding of module processes including lithography, dry etch, wet etch, CMP, thin films and metrology.
Exceptional written and verbal communication skills with ability to communicate complex concepts, solutions, and strategic initiatives.
Experience in integration in EUV-enabled technology nodes.
Experience in GAA (Gate-All-Around) technology architecture.
Experience in Cu BEOL Process Integration
Experience in advanced node semiconductor development or high-volume manufacturing.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.
Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust N/AWork Model for this Role
This role will require an on-site presence.
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Ocotillo Technology Fabrication Yield Engineer professionals in Phoenix
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Mohamed Amin
Electrical Tech