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Ocotillo Technology Fabrication Yield Engineer - Phoenix, United States - Taleo BE
Description
Job Details:
Job Description:
Join Intel and build a better tomorrow.
Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth.
As part of Intel's new IDM2.0 strategy, our high-volume manufacturing facility in Chandler, Arizona is looking for amazing talent. Join and help us create the next generation of technologies that will shape the future for decades to come.As a Device Engineer, your responsibilities may include but are not limited to:
Driving the factory to produce transistor and discrete electronic devices that perform according to strictly defined specifications.
Collaborating with Module, Integration, and Yield engineers to perform process modifications to produce material that meets quality, reliability, cost, yield, and performance requirements.
Strictly controlling the initial quality metrics at the end-of-line (EOL) in order to screen and disposition material prior to sort and class testing.
Extensive analyses are performed in order to determine specific root causes of discrepant device performance.Continuously improving quality, reliability, cost, and yield using a feedback loop through Integration and Module engineers to address targeting, variability reduction, and containment of poorly performing line segments.
Developing solutions to challenging technical problems utilizing a combination of fundamental knowledge of physical solid-state physics, statistical knowledge, and formal problem-solving methodologies.
Independently identifying improvement opportunities and driving the implementation of process changes to continuously improve the process and the organization.Summarizing complex problems using formal problem-solving strategies and communicating technical reasoning, project timelines, and help needed to senior leaders.
Working across multiple process segments to ensure full line health through performance and reliability metrics.
Mentoring Device team members in both technical and behavioral areas
Engaging with senior leaders from multiple teams, such as product engineers, assembly test engineers, and technology development engineers to understand and implement process improvement opportunities.
The ideal candidate would exhibit the following behavioral traits:Highly motivated with leadership qualities
Strong interpersonal skills with understanding of how to work with others to accomplish organizational goals.
A collaborative and inclusionary mindset
Highly developed written and verbal communication abilities to influence a wide variety of groups at all levels of the organization.
Excellent organizational skills with a strong attention to detailExperience with setting goals and achieving them on schedule.
High tolerance of ambiguity in a rapidly changing, fast-paced work environment with the ability to quickly adjust priorities as necessary.
Ability to develop creative solutions to challenging problems.Candidate must be able to effectively run meetings at all levels of the organization in order to effectively solve problems as a team and communicate progress to senior leaders.
Qualifications:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Experience listed below would be obtained through a combination of your school/ work/ classes/ research and/or current job role within the semiconductor manufacturing environment.
Minimum Requirements:
Masters of Science in Electrical Engineering, Physics, or Material Science AND 6+ years relevant experience in the semiconductor industry or
PhD in Electrical Engineering, Physics, or Material Science AND 3+ years relevant experience in the semiconductor industry
Candidate should have a high level of technical contributions and a proven history of technical problem solving.
Preferred Qualifications:
A comprehensive understanding of device physics, semiconductor processing, familiarity with failure analysis techniques, basic coding/scripting ability in JSL/SAS/Python, experience in data extraction, statistical process control, statistical data analysis and interpretation, familiarity with statistical software packages such as JMP or Minitab, and familiarity with DOE techniques
Familiarity with latest machine learning tools applied to process and device analysis to accelerate root cause determination.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.
Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust N/AWork Model for this Role
This role will require an on-site presence.
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