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    Electronics Packaging Engineer - Severn, United States - Jacobs Engineering Group Inc

    Jacobs Engineering Group Inc
    Jacobs Engineering Group Inc Severn, United States

    1 week ago

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    Description

    Your Impact:


    At Jacobs, we'll inspire and empower you to deliver your best work so you can evolve, grow and succeed – today and into tomorrow.

    With more than 55,000 people in 40 countries, working at Jacobs offers an exciting range of opportunities to develop your career within a supportive and diverse team who always strive to do the right thing for our people, clients and communities.

    People are Jacobs' greatest asset and we offer a competitive package to attract and retain the best talent.

    The Special Projects Division in the Rapid Solutions group of Jacobs operates like a small company with the benefits of Jacobs resources and currently has several exciting opportunities available for the right candidates.

    The Mechanical Engineering team is looking for an enthusiastic, highly motivated, and hardworking individual that takes ownership of their work, thrives on the opportunity to take on challenges, and takes pride in their accomplishments.

    An Electronics Packaging Engineer in the Special Projects division applies their engineering knowledge in the areas of 3D CAD design, GD&T, heat transfer, design for manufacturability, structural mechanics, composite materials, radome design, material properties, and other engineering design principles to various electronics packaging projects serving the Intelligence community.

    The designed packages and/or microelectronic systems must function in harsh environments produced by airplanes, ships, and automobiles in locations around the globe.

    In conjunction, they must withstand temperature extremes, thermal shock, vibration, structural shock, moisture, and corrosion.

    The Mechanical Engineering group is a high performing team with a breadth of experience in mechanical design, electronics manufacturing, electronics packaging, structural, and thermal analysis.

    The Electronics Packaging Engineer will support in some or all of the following areas:

    3D CAD (Solidworks) design and drafting of mechanical/electro-mechanical components and assemblies with a focus on design for reliability, manufacturing, and ruggedization.


    Performing engineering analyses:
    thermal, structural, tolerance stack-ups.
    Fabricating, assembling and qualifying 1st article engineering prototypes.
    Designing and conducting laboratory experiments to evaluate material selections and/or advanced electronic packaging manufacturing processes.
    Effectively collaborate across engineering disciplines to accomplish project tasks/objectives.
    Develop engineering qualification plans for requirements and workmanship verification.
    Identify technical risks and develop risk mitigation options with technical project team; Present options/solutions to project management.
    Research and identify capable vendors; Evaluate and select appropriate vendor and serve as primary technical interface.

    Here's what you'll need :
    U.S. Citizenship.
    Active TS/SCI with full scope poly security clearance.

    Bachelor's degree in Mechanical Engineering, Electro-Mechanical Engineering, Manufacturing Engineering, Materials Science Engineering, or similar degree from an ABET accredited University.


    • 6 years' experience in mechanical packaging of electronic components or systems (higher experience levels will also be considered).
    Strong problem-solving and troubleshooting skills.
    Experienced designing for electronics manufacturing processes
    Experienced performing PCB layouts or providing electro-mechanical design guidance to PCB layout.
    Familiar with various electronics manufacturing processes (such as SMT, PCB fabrication, polymerics application, solder chemistries, etc).
    Working knowledge of the electronics product development process.
    Experienced working in schedule driven, multi-disciplinary project teams.
    Excellent writing, communication, and interpersonal skills including a passionate, can-do attitude.

    Preferred Qualifications:
    Master's Degree with concentration in Electronics Packaging, Microelectronics, or Electronics Process Development.
    Experienced designing for microelectronics manufacturing processes.
    Experienced developing process maps.
    Experienced selecting cable terminations and connectors
    Experienced in wire routing and harness design.
    Machine design and drafting experience.
    Familiar with robotics design and controls.
    Hands-on manufacturing experience (e.g. machining, hand soldering, harness fabrication, etc).

    #J-18808-Ljbffr
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