Jobs
>
Arlington

    Semiconductor Packaging Engineer - Arlington, United States - Virginia Polytechnic Institute and State University

    Show more Collapse job
    Default job background
    Description

    Semiconductor Packaging Engineer

    Job no: 529504

    Work type: Administrative & Professional

    Senior management: College of Engineering

    Department: Electrical and ComputerEngineering

    Location: Arlington, Virginia

    Categories: Engineering, Other


    Job Description


    Virginia Alliance for Semiconductor Technology (VAST) is a Commonwealth of Virginia initiative to innovate Virginia's semiconductor, microelectronics, and nanotechnology ecosystem.

    VAST is an alliance of institutions of higher education to coordinate the semiconductor and nanofabrication cleanrooms, nano-characterization facilities, and advanced packaging and microelectronics centers across member institutions; to accelerate the development of a qualified workforce through a new Fast Track to Semiconductor Career program; and to market and promote the assets and infrastructure that supports the industry in the Commonwealth.

    VAST website will serve as the gateway to semiconductor and nanotechnology excellence in the Commonwealth.

    The VAST Headquarters will be at Virginia Tech Research Center (VTRC) in Arlington and founding members of the alliance are George Mason University (GMU), Virginia Tech (VT), University of Virginia (UVA), Virginia Commonwealth University (VCU), Norfolk State University (NSU).

    Each member may have more than one cleanroom or facility that participates in the network.

    Northern Virginia Community College will be a strategic partner for the workforce development and the Fast Track to Semiconductor Career programs.

    VAST is looking for a qualified engineer for the Semiconductor Packaging and Characterization Certification.

    The certificate program, part of the VAST Fast Track to Semiconductor Careers, will consist of synchronous and asynchronous online lectures, daily office hours, and about 5 hours of hands-on training per week.

    Fast Track to Semiconductor Careers initiative is aimed at reskilling and upskilling military veterans and adult learners for the semiconductor and electronics industry sector by teaching them the principles of semiconductor packaging.


    The VAST Semiconductor Packaging Engineer will:

    • Conduct handson training in the following areas: package materials and fabrication processes, package characterization and testing, electrical package design, thermal package design, and package reliability.
    • Design and develop process flows for substrate patterning, solder reflow, die bonding, wire bonding, shear and pull testing, and thermal cycling. Testing equipment may include curve tracer, impedance analyzer, network analyzer, and thermal analyzer.
    • Teach the program participants to use relevant design and simulation tools, packaging and characterization equipment, and design a semiconductor packaging project.
    • Ensure proper and safe equipment usage, and proper handling and disposal of materials and chemicals.
    • Gather information and prepare reports as instructed related to the use of the facilities and workforce training programs.
    • Work closely with faculty, students, and staff at partner universities to meet the needs and goals set by the VAST leadership team.
    • Travel between Blacksburg, VA and Arlington, VA, as needed to perform assigned tasks within the semiconductor packaging facilities.
    • Generate and provide data as needed to be integrated within the VAST cloudbased facilities management system.
    • Work with core groups to create an inventory of semiconductor and nanotechnology tools and equipment within the VAST nodes and beyond in the Commonwealth of Virginia

    Required Qualifications

    • Bachelor's degree or higher, or an associate degree with 5+ years of experience in semiconductor packaging.
    • Academic or industry training experience.
    • Laboratory experience in an academic or industry environment.
    • Knowledge of semiconductor packaging technologies and processes, design tools, and equipment.
    • Ability to assess the performance of trainees and students.
    • Collaborative team player with the ability to work crossfunctionally.
    • Evidence as a selfstarter who can work independently, as well as be a team contributor in a complex and fastpaced organization.
    • High degree of emotional intelligence.
    • Ability to work with highlevel administrators, executives, and professionals.

    Preferred Qualifications

    • Experience in the maintenance and repair of semiconductor packaging equipment.
    • Experience in course development and delivery.
    • Proven track record of handson group training and assessment.

    Appointment Type

    Restricted


    Salary Information

    Commensurate with Experience


    Review Date

    05/10/2024


    Additional Information

    The successful candidate will be required to have a criminal conviction check.


    About Virginia Tech


    Dedicated to its motto, Ut Prosim (That I May Serve), Virginia Tech pushes the boundaries of knowledge by taking a hands-on, transdisciplinary approach to preparing scholars to be leaders and problem-solvers.

    A comprehensive land-grant institution that enhances the quality of life in Virginia and throughout the world, Virginia Tech is an inclusive community dedicated to knowledge, discovery, and creativity.

    The university offers more than 280 majors to a diverse enrollment of more than 36,000 undergraduate, graduate, and professional students in eight undergraduate colleges, a school of medicine, a veterinary medicine college, Graduate School, and Honors College.

    The university has a significant presence across Virginia, including the Innovation Campus in Northern Virginia; the Health Sciences and Technology Campus in Roanoke; sites in Newport News and Richmond; and numerous Extension offices and research centers.

    A leading global research institution, Virginia Tech conducts more than $500 million in research annually.


    Virginia Tech does not discriminate against employees, students, or applicants on the basis of age, color, disability, sex (including pregnancy), gender, gender identity, gender expression, genetic information, national origin, political affiliation, race, religion, sexual orientation, or military status, or otherwise discriminate against employees or applicants who inquire about, discuss, or disclose their compensation or the compensation of other employees or applicants, or on any other basis protected by law.


    If you are an individual with a disability and desire an accommodation, please contact K Atkins at during regular business hours at least 10 business days prior to the event.

    Advertised: April 29, 2024

    Applications close: May 10, 2024 Eastern Daylight Time

    We have other current jobs related to this field that you can find below


  • The Otis Sampson Company Arlington, United States

    One of our leading partners in the packaging space has an opening for a Packaging Development Engineer. This position will be based out of their Arlington, TX facility and will focus on packaging design work. · Required: · BS in Engineering · 5+ years of experience in packaging d ...


  • Jacobs Severn, United States

    Your Impact: · At Jacobs, we'll inspire and empower you to deliver your best work so you can evolve, grow and succeed – today and into tomorrow. With more than 55,000 people in 40 countries, working at Jacobs offers an exciting range of opportunities to develop your career within ...


  • Leidos Alexandria, United States Full time

    Description · Leidos has an opening for a highly qualified Mission Package Integration Engineer for the Multi-Domain Solutions Division. This is an exciting opportunity to bring your experience to support across all-domain large-scale weapon systems, Information Technology Syste ...

  • IonQ Inc.

    Packaging Engineer

    4 weeks ago


    IonQ Inc. College Park, United States

    The salary range for this position is $93,150 - $121,958. · We are looking for a Packaging Engineer to develop and execute processes for ion trap characterization and packaging. Partnering with a cross-functional team, the Packaging Engineer will work to stand up critical assemb ...


  • Equity Packaging Gaithersburg, United States

    Equity Packaging, Inc. is a Global Package Development and Engineering Company that specializes in the management and improvement of packaging functions. The Company is headquartered in the United States of America, and has global presence with offices in major commercial centers ...


  • Integra LifeSciences Columbia, United States

    Changing lives. Building Careers. · Joining us is a chance for you to do important work that creates change and shapes the future of healthcare. Thinking differently is what we do best. To us, change equals opportunity. Every day, more than 4,000 of us are challenging what's pos ...


  • AstraZeneca Gaithersburg, United States Full time

    Join our Oncology R&D team as a Principal Engineer of Packaging Design and participate in our ambitious goal to deliver 6 new molecular entities by 2025. · In this role, you will be responsible for the planning, design & development, qualification and transfer of packaging materi ...


  • Tata Consultancy Services Fort Washington, United States

    Roles & Responsibilities : · o Plan and execute package engineering assignments concerned with large life · cycle management initiatives. · o Engage in the development of the material and structural aspects of packages, · including Primary, Secondary & Tertiary materials to u ...


  • Thorlabs Jessup, United States

    This position is responsible for developing optoelectronic packaging for advanced photonic components, including semiconductor lasers and photonic integrated circuits. Extensive experience with advanced photonic components and the ability to do the related optical and mechanical ...


  • Thorlabs Jessup, Maryland, United States Permanent

    This position is responsible for developing optoelectronic packaging for advanced photonic components, including semiconductor lasers and photonic integrated circuits. Extensive experience with advanced photonic components and the ability to do the related optical and mechanical ...


  • AstraZeneca, plc Gaithersburg, United States

    Join our Oncology R&D team as a Principal Engineer of Packaging Design and participate in our ambitious goal to deliver 6 new molecular entities by 2025. In this role, you will be responsible for the planning, design & development, qualification and Packaging, Engineer, Design, P ...


  • National Black MBA Association Gaithersburg, United States

    Join our Oncology R&D team as a Principal Engineer of Packaging Design and participate in our ambitious goal to deliver 6 new molecular entities by 2025. · In this role, you will be responsible for the planning, design & development, qualification and transfer of packaging materi ...


  • AstraZeneca Gaithersburg, United States

    Join our Oncology R&D team as a Principal Engineer of Packaging Design and participate in our ambitious goal to deliver 6 new molecular entities by 2025. · In this role, you will be responsible for the planning, design & development, qualification and transfer of packaging materi ...


  • Leidos Alexandria, United States

    Leidos has an opening for a highly qualified Mission Package Integration Engineer for the Multi-Domain Solutions Division. This is an exciting opportunity to bring your experience to support across all-domain large-scale weapon systems, Information Technology Systems, and Command ...

  • BlueSky Innovations

    Area Manager Systems

    3 weeks ago


    BlueSky Innovations Arlington, United States

    The Fraunhofer Society currently operates 76 institutes and research facilities in Germany and is the world's leading organization for applied research. Around employees work on an annual research volume of 3.0 billion euros. · The Fraunhofer Institute for Organic Electronics, El ...


  • BAE Systems Manassas, United States Full time

    Job Description · Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely. · See what you're missing. Our employees work on the world's most advan ...

  • The Otis Sampson Company

    Packaging Designer

    2 days ago


    The Otis Sampson Company Arlington, United States

    One of our leading partners in the packaging space has an opening for a Packaging Development Engineer. This position will be based out of their Arlington, TX facility and will focus on packaging design work. · Required: · BS in Engineering · 5+ years of experience in packaging ...


  • The University of Texas at Arlington Arlington, United States Full time

    Job Summary · The RESA V will conduct research to develop novel techniques for the heterogenous integration of diverse systems in package (2.5D/3.5D) with a focus on the reliability of packages; investigate and identify materials suitable for heterogenous integration, including ...

  • Allegient Defense

    Program Analyst

    2 days ago


    Allegient Defense Arlington, United States

    Allegient Defense is a Small Business providing technically oriented services from program management to advanced systems integration and engineering. We support Government and prime system integrators with engineering and management expertise. Allegient Defense helps clients wit ...

  • The Otis Sampson Company

    Packaging Designer

    1 day ago


    The Otis Sampson Company Arlington, United States

    One of our leading partners in the packaging space has an opening for a Packaging Designer. This position will be based out of their Arlington, TX facility and is an onsite role for a day shift operation. · Required: · BS in Engineering · 5+ years of experience of corrugated desi ...