Co-op Technical Assistant - Lexington, United States - MIT Lincoln Laboratory

MIT Lincoln Laboratory

Verified Company

Lexington, United States

2 weeks ago

Posted by:

Mark Lane

beBee recruiter

Description

Job Description- This 6-A internship is to develop architectures and designs for photonic integrated circuit (PIC) lasercom modems.

PIC modems can provide significant size, weight, manufacturability, ruggedization, and cost improvements as compared to conventional discrete-component based modem designs.

This project will investigate a range of topics that will help advance and mature PICs for the use in lasercom modems on mobile platforms.

These topics include:

Modeling and simulation of optical modem functions in silicon and siliconnitride PICs. This will entail transmitter, acquisition, and receiver functions.
Identifying and developing design approaches for lasers, modulators, transmitters, photoreceivers, variable optical attenuators, couplers, and filter devices required for a PIC modem.
Developing a roadmap path for designing an ASIC+PIC to achieve a fully integrated electrooptical modem.
Investigation of feasibility of integrated semiconductor optical amplifier (SOA) devices for power amplification and preamplification. Evaluation of their suitability for burstmode DPSK and coherent QPSK waveforms. MIT Lincoln Laboratory is an Equal Employment Opportunity (EEO) employer. All qualified applicants will receive consideration for employment and will not be discriminated against on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, age, veteran status, disability status, or genetic information; U.S. citizenship is required.

Requisition ID: 41081