RF/Microelectronics Packaging Engineer - Tempe

The principle packaging engineer is capable of managing all packaging aspects for a business unit. · ...

We are closer to farmers, enabling better quality, and more reliable, traceable and transparent supply. We add value through our unique manufacturing footprint and natural, delicious and nutritious products. · The Package Engineer is responsible for focusing on leading and suppor ...

The Southwest Advanced Prototyping (SWAP) Hub is looking for an Integrated Circuit Package Design Engineer. · Packaging design using Cadence Allegro/APD+ · Signal Integrity a plus HFSS a plus · ...

Leads intermediate to complex projects, provides technical guidance, design innovation expertise to enhance engineering solutions infrastructure. · Bachelor's degree five years experience appropriate area assignment field OR any equivalent combination experience training comparab ...

About usOne team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. · Working closely with project development teams and product groups (RFIC, MMIC, Module) to develop the next generation/sophist ...

The Southwest Advanced Prototyping (SWAP) Hub is looking for a Integrated Circuit Package Design Engineer. SWAP Hub brings together academic, industry, and government partners to accelerate microelectronics innovation and prototyping. · Bachelor's or Master's degree in Electrical ...

· The Southwest Advanced Prototyping (SWAP) Hubis looking for a Integrated Circuit Package Design Engineer. · The IC Package Design Engineer will developand design wafer level packages,understand design rulesand package selection · and work closelywith our industry partner Revi ...

The Southwest Advanced Prototyping (SWAP) Hub is looking for an Integrated Circuit Package Design Engineer.Leads intermediate to complex projects, and provides technical guidance, design, innovation, and expertise to enhance the institution's engineering solutions and infrastruct ...

We are seeking a Package Engineer to join our team for 6 months + Extendable duration. · Provides technical expertise within the packaging functional team. · Identifies and assesses complex technical problems and provides solutions and recommendations. · ...

This role will collaborate with IFS Customer product design teams to drive product architecture definition and execution. · ...

We have a great opportunity for a Senior Package Layout Engineer in our System-in-Package team This engineer will be part of a team responsible for implementing ARM's next generation of SoC's in the IoT, Automotive, and Compute spaces. · ...

We have a great opportunity for a Senior Package Layout Engineer in our System-in-Package team This engineer will be part of a team responsible for implementing ARM's next generation of SoC's in the IoT, Automotive, and Compute spaces. · The engineer will assist in the definition ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry leading semiconductor packaging technologies for mobile edge and hyperscale computing platforms. · As a Packaging Module Development Engin ...

We are looking for Senior Software Engineers to help lead our team responsible for Display Processor Driver Development. · This involves work on Linux kernel drivers and relevant related projects, upstreaming and code review, interacting with hardware engineering, using hardware ...

onsemi is seeking a self-driven and motivated professional to join their Corporate Central Engineering modeling and simulation team. ...

· , New package and system integration development/li>, New product design assembly process quality reliability customers in worldwide/li> ...

Lensa is a career site that helps job seekers find great jobs in the US. We are not a staffing firm or agency.We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ or Oregon. · ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for developing industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. · ...

We are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business. · We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. · Drives end-to-end development for substrate desig ...

We are looking for someone who is passionate about learning new technical skills in software development and test technology. As a valued team member,your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, · Develops a ...