Package Engineer - Scottsdale, AZ

· Company Description · 360 IT Professionals is a Software Development Company based in Fremont, California that offers complete technology services in Mobile development, Web development, Cloud computing and IT staffing. Merging Information Technology skills in all its services ...

· , New package and system integration development/li>, New product design assembly process quality reliability customers in worldwide/li> ...

· ofi is a global leader offering naturally good food & beverage ingredients and solutions. At the forefront of consumer trends, we provide manufacturers and retailers with products and ingredients that will delight their consumers. Making a positive impact on people and planet ...

We are closer to farmers, enabling better quality, and more reliable, traceable and transparent supply. We add value through our unique manufacturing footprint and natural, delicious and nutritious products. · The Package Engineer is responsible for focusing on leading and suppor ...

Description · ofi · is a global leader offering naturally good food & beverage ingredients and solutions. At the forefront of consumer trends, we provide manufacturers and retailers with products and ingredients that will delight their consumers. Making a positive impact on peopl ...

This role will collaborate with IFS Customer product design teams to drive product architecture definition and execution. · ...

Step into a career with ASM, where cutting edge technology meets collaborative culture. · For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people ...

· The Southwest Advanced Prototyping (SWAP) Hubis looking for a Integrated Circuit Package Design Engineer. · The IC Package Design Engineer will developand design wafer level packages,understand design rulesand package selection · and work closelywith our industry partner Revi ...

The Southwest Advanced Prototyping (SWAP) Hub is looking for an Integrated Circuit Package Design Engineer.Leads intermediate to complex projects, and provides technical guidance, design, innovation, and expertise to enhance the institution's engineering solutions and infrastruct ...

We are looking for a Packaging Module Development Engineer to join our team in Phoenix, US. The successful candidate will work on cutting-edge applications of machine vision and machine learning to solve complex semiconductor packaging manufacturing challenges. · ...

Job Details: · Job Description: · Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, y ...

Join our team to work on cutting-edge applications of machine vision and machine learning to solve complex semiconductor packaging manufacturing challenges. ...

We are looking for someone who is passionate about learning new technical skills in software development and test technology. · As a valued team member your adaptability and attention to detail will contribute to our drive for results. · ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for developing industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. · ...

We are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business. · We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. · Drives end-to-end development for substrate desig ...

Join our team to work on cutting-edge applications of machine vision and machine learning to solve complex semiconductor packaging manufacturing challenges. · ...

The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms. · Developing FLI/SLI and Thermal solutions ...

Lensa is a career site that helps job seekers find great jobs in the US. We are not a staffing firm or agency.We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ or Oregon. · ...

The Southwest Advanced Prototyping (SWAP) Hub is looking for a Integrated Circuit Package Design Engineer. SWAP Hub brings together academic, industry, and government partners to accelerate microelectronics innovation and prototyping. · Bachelor's or Master's degree in Electrical ...

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ · For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our peop ...