Package Engineer - Scottsdale, AZ

We are seeking a Package Engineer to join our team for 6 months + Extendable duration. · Provides technical expertise within the packaging functional team. · Identifies and assesses complex technical problems and provides solutions and recommendations. · ...

onsemi is seeking a self-driven and motivated professional to join their Corporate Central Engineering modeling and simulation team. ...

· , New package and system integration development/li>, New product design assembly process quality reliability customers in worldwide/li> ...

We are closer to farmers, enabling better quality, and more reliable, traceable and transparent supply. We add value through our unique manufacturing footprint and natural, delicious and nutritious products. · The Package Engineer is responsible for focusing on leading and suppor ...

This role will collaborate with IFS Customer product design teams to drive product architecture definition and execution. · ...

· The Southwest Advanced Prototyping (SWAP) Hubis looking for a Integrated Circuit Package Design Engineer. · The IC Package Design Engineer will developand design wafer level packages,understand design rulesand package selection · and work closelywith our industry partner Revi ...

Join our team to work on cutting-edge applications of machine vision and machine learning to solve complex semiconductor packaging manufacturing challenges. · ...

We are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business. · We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. · Drives end-to-end development for substrate desig ...

The Southwest Advanced Prototyping (SWAP) Hub is looking for an Integrated Circuit Package Design Engineer.Leads intermediate to complex projects, and provides technical guidance, design, innovation, and expertise to enhance the institution's engineering solutions and infrastruct ...

We are looking for someone who is passionate about learning new technical skills in software development and test technology. · As a valued team member your adaptability and attention to detail will contribute to our drive for results. · ...

The Southwest Advanced Prototyping (SWAP) Hub is looking for a Integrated Circuit Package Design Engineer. SWAP Hub brings together academic, industry, and government partners to accelerate microelectronics innovation and prototyping. · Bachelor's or Master's degree in Electrical ...

The Southwest Advanced Prototyping (SWAP) Hub is looking for an Integrated Circuit Package Design Engineer. · Packaging design using Cadence Allegro/APD+ · Signal Integrity a plus HFSS a plus · ...

One team. Global challenges. Infinite opportunities. At Viasat, we're on a mission to deliver connections with the capacity to change the world. · ...

Join our team to work on cutting-edge applications of machine vision and machine learning to solve complex semiconductor packaging manufacturing challenges. ...

Lensa is a career site that helps job seekers find great jobs in the US. We are not a staffing firm or agency.We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ or Oregon. · ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for developing industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. · ...

The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms. · Developing FLI/SLI and Thermal solutions ...

We are looking for a Packaging Module Development Engineer to join our team in Phoenix, US. The successful candidate will work on cutting-edge applications of machine vision and machine learning to solve complex semiconductor packaging manufacturing challenges. · ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. · Contribute to the advancement of tech ...

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology De ...