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    Principal Packaging Engineer - Irvine, United States - Skyworks Solutions

    Skyworks Solutions
    Skyworks Solutions Irvine, United States

    3 weeks ago

    Default job background
    Description
    If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.

    Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

    At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking.

    We value open communication, mutual trust, and respect.

    We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

    Requisition ID: 72982

    Job Description
    Looking for a Principal Packaging Engineer to support new product development. Candidate will be the RF packaging interface between design teams and internal/external manufacturing.

    Your primary responsibilities will be:

    • Working with IC design teams to define the package requirements.
    • Ownership of specific product from feasibility stage to high volume production.
    • Ensuring that DFM/BKM is implemented for assembly yield, cost, and reliability.
    • Developing new assembly technologies, running process DOE's, identifying new materials and equipment, reliability testing, and qualification of new assembly process.
    Job Requirements

    • BS Degree in either Electrical Engineering, Mechanical Engineering, Process Engineering, or Material Science.
    • Minimum 12 years experience (or MS and 8 years) in semiconductor packaging technology
    • Strong project management and communication skills (verbal, written, and presentation).
    • Expertise with overmolded laminate module packaging processes: SMT, Wirebonding, Die Attach, and Molding.
    • Knowledge of various assembly processes: Flip Chip Bumping, Fan Out, WLCSP, BGA, Module Level Shielding, and IPDs.
    • Experience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding,
    • Experience working with OSAT Assembly Factories in Asia.

    Preferred Experience:

    • Hands on experience with assembly process/equipment.
    • Background in module design
    • Understanding of RF products and concepts is highly desired.
    • Experience with Failure Analysis.
    • Understanding of Module and Board Level Reliability requirements.
    • Understanding of manufacturing of organic laminate technologies.
    #LI-DD1
    The typical base pay range for this role across the U.S. is currently USD $124,400 - $235,700 per year.

    Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location.

    Skyworks has different base pay ranges for different work locations in the U.S.

    #J-18808-Ljbffr
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