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    Sr. Principal Packaging Engineer - Irvine, United States - Skyworks

    Skyworks
    Skyworks Irvine, United States

    2 weeks ago

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    Description

    If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time .

    At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We value open communication, mutual trust, and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

    Job Description

    In this role, candidate will lead electroless plating process development and quality improvement for both internal factory in Baja California and external contractors. Candidate will closely work with internal Factory team, Reliability, Test and Product Engineering, and Customer Quality Engineering team and also material & equipment suppliers. Candidate will be responsible for driving resolution of Quality Excursions and Continuous improvement in Quality & Manufacturing Efficiency as well.

    Roles & Responsibilities

  • Lead technology development and qualification of a surface treatment plating process
  • Lead setup of an electroless plating process line for semiconductor surface treatment in both Skyworks internal factory in Baja California and external contractors
  • Coworking with internal factory team to setup electroless plating process line and quality control methodologies
  • Coworking with Reliability Engineering to optimize plating stack up to improve Board level reliability performance
  • Coworking with Test and Product Engineering to optimize plating to improve ATE success rate and visual criteria
  • Coworking with to solve Quality issues related with surface finish treatment
  • Drive resolution of Quality Excursions
  • Drive Continuous improvement in Quality & Manufacturing Efficiency
  • Benchmarking and implementing industry leading solutions
  • Mentoring electroless plating engineers and technicians
  • Direct report to Director of Global Packaging Technology Development

    • Qualifications

    Expert in PCB surface treatment plating processing, including deep understanding of scientific and technical background on electroless plating process
    Hands on experience on best-in-class electroless surface treatment plating process and quality control including process control methodologies, control plan and OCAP Process
    Deep understanding on failure mode of PCB surface treatment and 2nd level solder joint
    Familiar with analytical techniques for electroless bath control and maintenance
    Familiar with statistical analysis, SPC, FMEA, and problem solving technics
    Excellent leadership and verbal and written communication skills.

    Education Requirements
    Bachelor, Master or PhD degree in Materials Science, Chemical Engineering, Physics or related field with 10+ years of experience in surface finish treatment plating process and 15+years of microelectronics industry (12+ years with Master, 8+ years with PhD)

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