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    Photonics Packaging Engineer - San Diego, United States - DeepSight Technology

    DeepSight Technology
    DeepSight Technology San Diego, United States

    3 weeks ago

    Default job background
    Description
    DeepSight Technology Inc . is a rapidly growing startup company that has developed breakthrough technology in

    ultrasound imaging. This new technology will both extend the range and clarity over current systems by 10x - 100x We

    are setting new standards that will dramatically improve the capabilities of ultrasound for many years.

    In order to develop and improve this technology, we need dedicated team players on our side. Not only do we offer

    a great team-oriented environment, but we also offer competitive compensation of

    $75K to $200K

    per year

    and generous benefits in both

    our Clayton, MO (a suburb of St. Louis) and Santa Clara, CA offices.
    Job Description
    In photonics, the packaging design is as crucial as the photonic integrated circuit (PIC) design. This is especially true

    when the product interfaces and interacts with the physical world. In this role, as a member of a multi-disciplinary

    product development team, you will own the packaging development from concept to production for state-of-the-art

    photonic integrated circuits. You will be also involved in integrating photonics components with other modules in the

    system. This position will be looking for someone who can design, develop, and validate a low-cost, high-performance,

    and reliable packaging platform for photonics components and system integration.

    Responsibilities include:
    Conceive novel concepts for low-loss and low-cost fiber packaging through optical/mechanical design and
    modeling of photonic chip coupling interfaces
    Simulate the performance of optical assemblies, with a mind towards the interface between PICs and package,
    as well as manufacturing tolerances.
    Characterize and qualify the developed packaging solution (optical/mechanical/reliability) with device and
    systems engineers.
    Work with contract manufacturers to define design rules for manufacturing.
    Document and report to internal members and communicate with external vendors and partners
    Qualifications
    BS or above a relevant technical field (Optics, Mechanical, Electrical, Materials Science, Applied Physics, or
    similar)
    5+ years of hands-on experience in packaging fiber-coupled devices and photonics integrated circuits chips.
    Experience designing for manufacturability and automated assembly and characterization
    Knowledge of fiber-optical systems and optical polymers
    Experience with 3D printing and/or CNC machining is preferred
    Ability to read and interpret engineering specifications, drawings, manufacturing instructions, and technical
    analyses.
    Industry experience creating detailed design documentation (specifications, design descriptions, verification,
    and testing plans).
    Other Qualities We Are Looking For
    Positive - a can-do attitude that helps you rise to challenges
    Collaborative - a team player who can effectively communicate with others
    Attentive to detail - nothing gets by you
    Efficient - a knack for effectively prioritizing tasks and managing your time
    Pride in your work - real desire to do quality work
    Career-minded - looking for more than a job
    Benefits and Perks

    We offer great benefits and perks:
    Competitive salary
    Stock options
    Medical, dental, and vision insurance
    401(k) retirement plan

    Locations: 63101, 95051

    #J-18808-Ljbffr
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