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LTD Thin Films and CMP Area Senior Principal Engineer - Hillsboro, United States - Workday
Description
Job Details:
Job Description:
About the Group
Technology Development (TD) is the heart and soul of Moore's Law at Intel. TD has enabled Intel to create world-changing technology that enriches the lives of every person on earth.
TD's more than 13,000 employees drive breakthrough research, develop next generation process and packaging technologies, while also running high volume manufacturing operations in its state-of-the-art facilities in Oregon and Arizona.
The Logic Technology Development (LTD) team in TD, delivers programs and modules to ramp new process nodes, supports HVM and provides a predictable technology cadence for Intel customers. Intel is in the middle of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. To do this it requires focused enthusiastic leaders. Join LTD and help create the next generation of technologies that will touch the lives of people the world over for decades to come.About the Role
Responsibilities include but are not limited to:
Technology strategic planning - Envision and articulate strategic technology plans that will fit across multiple process generations and integrate into the larger goals of the individual programs.
Negotiate, and proliferate strategic technology plans across multiple internal and external groups rather than follow someone else's roadmap.Enabling innovations- To deliver program goals with deep process technology inside from both integrated flow and fundamental module capabilities.
Taking initiative - Working in a highly dynamic environment, with a large number of partners and stakeholders requires the ability to prioritize critical projects with clear process technology vision and tenacity to succeed.
Monitor and drive performance - Equipment performance and continuous improvement of process modules is required to meet development commitments and, ultimately, deliver cost-effective modules to Intel manufacturing organizations.
Develop Culture - Needs to demonstrate emotional intelligence to understand how work is completed, how to remove roadblocks, Will be expected to fully support corporate initiative and to help leadership in developing a vibrant, diverse, and inclusive cultural environment where employees and bring their whole selves and contribute and grow to their maximum potentials.
Lead External Interactions - Will play a leadership role in collaborating with equipment and materials suppliers to develop technology.Lead efforts to establish Intel as the leader for process technology in its area of responsibility and ensure that supplier strategic plans are aligned with Intel's needs.
Partner with Product and Technology Program Managers to deliver novel process modules to meet needs and with production teams to achieve output goals.
Must be willing to occasionally work in a clean room environment wearing a gown, hood, booties, safety glasses, and gloves.
Required Experience10+ years of experience leading and setting priorities for multiple engineering teams in a large organization.
10+ years of manufacturing process development experience working with advanced semiconductor technology nodes.
Experience in working as a module engineer delivering innovation to enable program goals.
Significant Experience in leading teams working on interactions between process modules and programs.
Significant Experience in collaborating with or working in major semiconductor suppliers, preferably related to thin films and CMP.
Must be able to start within 3 months of receiving an offer.
Qualifications:
Ph.
D. degree in Physics, Material Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or a closely related field.
15+ years of experience in research and/or work in the semiconductor industry.
Job Type:
Experienced Hire
Shift:
Shift 1 (United States of America)
Primary Location:
US, Oregon, Hillsboro
Additional Locations:
Business group:
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.
Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust This role is a Position of Trust.Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks.
For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.
In certain circumstances the work model may change to accommodate business needs.#J-18808-Ljbffr
