Engr Prin, Simulation tl - Scottsdale, United States - onsemi

onsemi
onsemi
Verified Company
Scottsdale, United States

2 weeks ago

Mark Lane

Posted by:

Mark Lane

beBee recruiter
Description

onsemi is seeking a self-driven and motivated professional to join their Corporate Central Engineering modeling and simulation team, located in (Portland, Maine, Phoenix, AZ or San Jode, CA).

As a senior packaging electrical simulation engineer, you will have the opportunities to support new package and system integration development and new product design, assembly and process, quality and reliability, and customers in worldwide.


onsemi (Nasdaq:
ON) is driving disruptive innovations to help build a better future.

With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

onsemi is an Equal Opportunity and Affirmative Action employer. The Company maintains policies and practices that are designed to prevent discrimination or harassment against any qualified applicant or employee to the extent prohibited by federal, state and local laws and regulations. By way of example, discrimination on the basis of race (actual or perceived), ethnicity, color, religion, ancestry, national origin, citizenship, sex, age, marital status, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other characteristic protected by applicable law is prohibited.

  • PhD degree (or Master degree with 3 year experiences) in Electrical Engineering, electrical simulation, Physics with esimulation.
  • Experience and skills in electrical modeling and simulation in packaging and system level
  • Knowledge and experience of CAD concepts and Solidworks
  • Familiar with semiconductor packaging and system integration
  • Familiar with material electrical properties
  • Strong knowledge of problem analysis and diagnosis technique
  • Familiar with package test and analysis, quality assurance, and reliability methods
  • Ability to perform model correlation to empirical measurement
  • Familiar with the Unix/Linux operating system
  • Familiar with FEA software ANSYS HFSS, SIWave, Q3D, Maxwell and ANSYS electronics desktop
  • Strong English communication capability
  • Strong learning capability Good team player
  • Do packaging and system level integration electrical simulation
  • Do electricalthermalmechanical interaction for ISG chiplet, ASG, 3D integration and next generation breakthrough power module
  • Parasitic RLC for low frequency
  • High frequency simulation including MIPI/Sparameters
  • Do analysis and correlation of modeling results to measured data
  • Develop and maintain the state of art system integration, electrical, electricalthermo modeling methodology to improve the modeling work efficiency and accuracy
  • Setup and maintain the HW/SW environment for electricalthermomechanical modeling
  • Innovation of new technology through simulation
  • Develop the state of art simulation methodology such as AI and machine learning algorithm, probability and optimization algorithm
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