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    Technical lead - Madison, United States - HCL Technologies

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    Description

    Position:
    eCAD Designer, Electrical Engineering or PCB Layout Engineer
    Medical Background is preferable with ECE Background

    Key Words:
    PCB Layout with Highspeed board design, Cadence Tool Exposure, DFT/DFM, Signal Integrity analysis,
    Rework, Soldering, Troubleshooting, Rework, Lab Technician, Cable Hareness

    Role Summary Description:


    This role will be responsible for the execution of PWB layout for RF, Power, Analog and Mix Signal used within a Magnetic Resonance (MR) system.

    The candidate will leverage knowledge of design techniques and communication standards to ensure a quality product.

    This is not a remote position given the nature of lab co-work and local communication is expected for candidate to execute in person.

    Job Responsibilities

    • Packaging circuit boards into mechanical enclosures and assemblies leveraging Cadence Design tools and IPC standards.
    • Guide engineers in component selection, placement, stackup and material cost, routing, incircuit test point location, artwork generation, assembly drawing creation, manufacturing documentation, archival and configuration control
    • Work with global suppliers and create design outputs with a global team
    • Review external supplier layout designs to ensure high quality, as needed
    • Institutionalize operating mechanisms that ensure standardization of work across multiple teams
    • Utilizing independent judgement, construct, evaluate and improve complex engineering problem statements and promote creative solutions to improve engineering efficiency and outcomes.
    • Take ownership for business objectives including delivery, EHS, productivity, cost management, serviceability, quality.
    Required Qualifications

    • Associates degree or equivalent in electronics technology
    • Minimum of 7 years experience with complex analog, power, high speed digital, or RF PWB designs
    • Demonstrated teamwork, coordination, and communication skills both locally and globally
    • Demonstrated IPC PWB design principles knowledge
    • Demonstrated ability to lead and supervise a team of eCAD designers or external vendors.
    • Demonstrated experience with circuit stackups and routing with 2 to 14+ layers
    • Experience with Cadence CAD capture and design tools
    • Demonstrated experience with microvias, very fine pitch devices, and highdensity processors/FPGAs (>1000 contact BGAs)
    To prepare and submit status reports for minimizing exposure and risks on the project or closure of escalations.
    To develop and guide the team members in enhancing their technical capabilities and increasing productivity
    TO ensure process compliance in the assigned module, and participate in technical discussionsorreview.
    To be responsible for providing technical guidance or solutions

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