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    Senior Staff Engineer, Optical Packaging Design - Santa Clara, United States - Marvell Technology

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    Description
    Include. Develop photonics IC (PIC) and electronics IC (EIC) co-design flow. Define PIC and EIC IO pad frame and 2.5 D interposer floor plan. Lead PIC and EIC interconnect schematic and layout design process. Define PIC and EIC hybrid integration pac Packaging, Optical, Design, Staff, Engineer, Electrical Engineer, Technology, Business Services


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