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Technical Lead, Package Design Engineering - Mountain View, United States - Enfabrica
Description
Job Description
Job DescriptionSummary
Join a world-class team of silicon and distributed systems experts at Enfabrica as a Package Design Engineering Lead. You have the opportunity to be part of building a groundbreaking new category of products that revolutionize the performance and scalability of next-generation AI and accelerated computing systems, and to help solve key infrastructure challenges facing our customers.
We are looking for talented, motivated engineers with experience in building high power, high speed, megascale networking and computing devices, and who are looking to grow in a fast paced, dynamic startup environment. We are looking for experienced semiconductor package designers who have the range to contribute across the full lifecycle of complex package and system development, and who enthusiastically seek full ownership of large scale, challenging designs from concept to production.
Roles and Responsibilities
Skills/Qualifications:
Target Companies: Cisco, Juniper, Google, Annapurna, Innovium, Mellanox/Nvidia, Broadcom, Barefoot, Intel, Fungible, Cavium/Xpliant, Marvell, Google, Cray, Mediatek/Nephos, Insieme, Nuova
Company Background
Enfabrica is on a mission to revolutionize AI compute systems and infrastructure at scale through the development of superior-scaling networking silicon and software which we call the Accelerated Compute Fabric. Founded and led by an executive team assembled from first-class semiconductor and distributed systems/software companies throughout the industry, Enfabrica sets themselves apart from other startups with a very strong engineering pedigree, a proven track record of delivering, deploying and scaling products in data center production environments, and significant investor support for our ambitious journey Together, with their differentiated approach to solving the I/O bottlenecks in distributed AI and accelerated compute clusters, Enfabrica is unleashing the revolution in next-gen computing fabrics.
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