A Photonic Packaging Engineer is a professional who designs and develops packaging solutions for photonic devices. This includes creating protective enclosures, designing electrical connections, and ensuring optimal performance and reliability of the devices - Ider, United States - Crimson Enterprises
Description
Join a cutting-edge team as a Packaging Engineer at Ider, where you'll lead efforts in the exciting field of photonic packaging. This vital role blends development and production, incorporating technologies like electrical wire bonding, 3D printing, and fiber-to-chip assembly. You'll be central to advancing our single photon detector chip technology, reporting directly to our Chief Technology Officer (CTO).
What You'll Do:
- Design and fabricate innovative photonic structures using the Nanoscribe Quantum X Align printer.
- Execute cryogenic packaging for quantum applications.
- Conduct optical testing in a laboratory setting.
- Collaborate with interdisciplinary teams to refine processes and maintain quality standards.
- Innovate within the field of photonics packaging.
- Work in cleanroom environments with precise handling of chip dies.
What You'll Bring:
- Master's or PhD in Physics, Electronic Engineering, Photonics, or a related field.
- Experience with Nanoscribe GT or Quantum X printers is highly desirable.
- Industry experience in photonics packaging.
- Proficiency in Python or similar programming languages.
- A passion for new technologies and problem-solving.
- Willingness to travel for customer installations.
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