Process Technician - Goleta, United States - KYOCERA SLD Laser, Inc

Mark Lane

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Mark Lane

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Description

The company is ISO 9001 certified and automotive compliant to IATF 16949, and operates facilities in Santa Barbara, CA and in Fremont, CA.

KSLD's high luminance LaserLightTM sources are UL and IEC safety certified.

The company was recently ranked 7th in Fortune magazine's "2021 Best Workplaces in Manufacturing & ProductionTM," having promoted an employee-centric corporate culture since its founding.


Experience and Skills:


Specific Responsibilities

  • This role will focus on the rapid execution of laser processing lots, process development, and associated testing for the characterization of device and process performance.
  • Contributing to the improvement of process techniques is also expected.
  • This person will play an important role in developing new laser device structures and fabrication processes.
  • Process lots in wafer fab (lithography, thin film deposition, dry etch, wet etch, microscopy, metrology, etc.)
  • Execute test / split lots and help develop new wafer fab processes.
  • Testing of devices and teststructures
  • Tracking of process steps, documenting results, and daily pass downs
  • Data entry and process calculations such as deposition and etch rates and timed.

Experience and Skills

  • Requires a High School Diploma or Equivalent with 2+ years of experience, or AS or BS with some wafer fab experience highly desired.
  • Ability to manage various tasks in given schedule.
  • Ability to work with mínimal guidance in a dynamic environment.
  • Good communication skills. Able to work alongside engineering staff and technicians.
  • Experience working as a technician or experienced operator in a wafer fab environment; working on the typical modules in wafer fabrication is preferred, but not required.
  • Experience with several of the following processes is plus: lithography (spin coat, stepper, mask aligner), thin film deposition (sputter, Ebeam, PECVD), wet etch, dry etch (RIE, ICP RIE), saw dicing, wafer thinning, laser scribe and break, test (manual or automated probe station)
  • III-V experience preferred, but not required.
  • Must be willing to work morning or evening shift. Preferred morning shift.


The full-time base salary range for the Process Technician position is $21.00 to $24.00 per hour The range reflects the minimum and maximum possible base salary for new hires for the role, based on the advertised location.

Individual pay is determined by several factors including work location, job-related skills, experience, and relevant education and training. For more information about the base salary range applicable to the work location, talk to your recruiter.

  • The above statements are intended to describe the general nature and level of work being performed by people assigned to this job. They are not intended to be an exhaustive list of all responsibilities, duties, and requirements of personnel as classified._

Job Benefits:

Medical

Dental

Vision

401K


From:
KYOCERA SLD Laser, Inc

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