- Work closely with Test and Product engineering teams to enable productization.
- Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues.
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SoC Chip Lead
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ASIC Chip Lead
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SoC Chip Lead
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NXP Semiconductors N.V. Austin, United States· • MCU/MPU Engineering team defines and develops System on Chip, ASIC's, Digital and Analog IP's for a wide range of products, including automotive microprocessors, application processors, microcontrollers, and network processors. · Responsibilities: · • Lead product executi ...
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ASIC Chip Design Lead
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ASIC Chip Design Lead
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ASIC Chip Lead and Design Engineer
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ASIC Chip Lead and Design Engineer
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Chelsea Search Group Austin, United StatesSenior/Lead Logic Design and Chip Integration Engineer Full-time/Direct-hire position 100% remote / work from any US location US Citizen or US Permanent Resident only Requirements: · •10+ years of experience in Logic Design and Chip Integration · •Experience with embedded proce ...
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Chelsea Search Group Austin, United StatesSenior/Lead Logic Design and Chip Integration Engineer · Full-time/Direct-hire position · 100% remote / work from any US location · US Citizen or US Permanent Resident only · Requirements: · • 10+ years of experience in Logic Design and Chip Integration · • Experience with embedd ...
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Chelsea Search Group Austin, United StatesSenior/Lead Logic Design and Chip Integration Engineer · Full-time/Direct-hire position · 100% remote / work from any US location · US Citizen or US Permanent Resident only · Requirements: · •10+ years of experience in Logic Design and Chip Integration · •Experience with embedded ...
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Physical Design
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Haavia, Inc. Austin, United States ContractPhysical Design (STA) Engineer · Location: AUSTIN (US:73301), TX (Hybrid Model) · Duration: 3 Months Contract · Rate: ALAP (As long as possible) · Client: CAPGEMINI · Roles & Responisbilities:Full chip timing constraints development, full chip Static Timing Analysis, and Signoff ...
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Program Specialist V
4 weeks ago
Texas Department of Aging & Disability Services Austin, United StatesJob Description: · The Texas Health and Human Services Commission (HHSC) Medicaid and CHIP Services (MCS) division seeks highly qualified candidates to fill two Program Specialist V positions. The Program Specialist V positions report to the Quality Assurance Director and work as ...
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Program Specialist VII
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Program Specialist VII
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Research Specialist V
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Contract Specialist IV
3 weeks ago
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Director IV
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Director, Program Policy
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mmWave DFT/ RF Post-Silicon Engineer
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SoC Chip Lead - Austin, United States - NXP Semiconductors
Description
MCU/MPU Engineering team defines and develops System on Chip, ASICs, Digital and Analog IPs for a wide range of products, including automotive microprocessors, application processors, microcontrollers, and network processors.
Responsibilities:
Lead product execution for Automotive/Consumer/Industrial ASIL-B/D SoCs
Work with architects and systems engineering to define the part. Generate and analyze data to take right and cost-effective architecture decision.
Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part.
Work with IP and SoC functions (front end, verification, AMS, DFT, Physical implementation) to understand and resolve inter/intra functional handoff and challenges.
Oversee definition management and make sure the implementation complies with the requirements
Work closely with downstream team's dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed
Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects.
Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements
Mentor engineers across various functions
Cross functional aspects:
This role is primarily about leading cross functional teams
During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors
During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.
Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams.
Overall, Chip lead is central design point of contact for all cross functional teams associated with the part.
Job Qualifications:
Bachelors in engineering with 15 years of design development experience, with at least 5 years of leading complete design and/or design functions.
MS in Electrical Engineering preferred (higher level education may substitute for some experience).
Experience in leading Global cross functional teams
Experience in leading designs in smaller geometries desired
