Internship: Package Thermal Prediction - Grosse Pointe, MI, United States - ZephyrTech
Description
In this exciting new role, you will be a valuable member of our team in Grosse Pointe, MI, working on the development of a cutting-edge tool that can accurately predict the thermal performance of semiconductor packages.
Your responsibilities will include defining, planning, and executing projects, as well as programming and scripting using the latest Machine Learning and Artificial Intelligence algorithms.
You will also have the opportunity to test the tool's capabilities using real simulation data and potentially expand its use to other areas of Package Simulation.
After completing the internship, there is potential for a working student position if you are interested.
To excel in this role, you should be currently studying computer science or a related engineering field, possess excellent programming skills, and have some experience with Machine Learning, Deep Learning, and/or Artificial Intelligence.
To apply, please submit your CV in English, a certificate of enrollment at your university, an excerpt of your study regulations for the mandatory internship (if applicable), a transcript of your latest grades (not older than 6 months), and your high school report.
Our headquarters in Neubiberg near Munich is home to over 6000 employees working in research and development, central functions, IT, and more.
At Infineon, we value work-life balance and offer a location just outside of Munich with endless
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