Semiconductor Packaging Engineer (Intern 2026) - San Jose, CA

The job duties include new product introduction NPI: New product package development from design through qualification up to release of the product to production. Development of new module package technologies working closely with the product design engineers and the factories. B ...

This is an exciting opportunity to work with a semiconductor startup that has raised over $100m in funding and is rapidly growing. · This role involves working on mechanical designs for advanced electronic packaging and optical components. ...

This is an exciting opportunity to work with a semiconductor startup that has raised over $100m in funding and is rapidly growing. · Work on mechanical designs for advanced electronic packaging and optical components. · ...

We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics. · ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages. · Overall design responsibility for ASIC package designs. · ...

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. · As a member of our packaging team, you'll have the chance to interact with many product groups and functions.You'll have high visibility on your projects, ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages. · Overall design responsibility for ASIC package designs. · Package Design of critical structures for SerDes, ADC/DAC, DDR etc. · ...

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, · Bachelor's or Master's degree in Electrical Engineering, Elec ...

This well-funded start-up is building a new class of high-resolution perception sensing technology for ADAS and autonomous driving. · ...

Seeking an IC Packaging Engineer to lead the development and delivery of advanced multi-chip packaging solutions for THz-system RFIC soC and high-speed digital applications.This high-impact role combines technical leadership hands-on package design collaboration with OSATs on foc ...

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. · The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, · with a solid understanding of substrate manufacturing and a ...

We are seeking a highly skilled Package Design Engineer with 5–8 years of experience in advanced IC packaging. The ideal candidate will have strong expertise in Flip Chip and multi-layer substrate (8+ layers) design, with a solid understanding of substrate manufacturing and assem ...

We are now looking for a Package Design Engineer in the Advanced Technology Group (ATG). · NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative solutions to extraordinary problems in a wide ra ...

We are now looking for a Package Design Engineer in the Advanced Technology Group (ATG). · NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative solutions to extraordinary problems in a wide ra ...

About Analog Devices is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. · Develop new product package development from design through qualification up to release of the product to production. · Work close ...

Position Summary: · Packaging Design Engineer I is primarily responsible for developing custom packaging designs and specifications in compliance with customer- or industry standards while meeting performance requirements, sustainability goals, and maintaining cost-effectiveness. ...

The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. · Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultr ...

We are looking to hire a Lead IC Packaging Engineer for advanced multi-chip packaging solutions - integrating THz-system RFIC, SoC, and high-speed digital chiplets into a single system. · ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. You will be responsible for designing and optimizing high-performance, high-density Interposers for chiplet-based architectures and heterogeneous integration solu ...

We have partnered with a semiconductor manufacturing firm in the San Jose, CA area to provide them with a Senior Staff Packaging Engineer. · Please review the below description and let us know if you are interested. · ...

We are seeking a skilled Advanced Package Design Engineer to join our Packaging Engineering team in SK Hynix America. · ...