SoC Chip Lead - Sealy, United States - NXP Semiconductors

Description

MCU/MPU Engineering team defines and develops System on Chip, ASIC's, Digital and Analog IP's for a wide range of products, including automotive microprocessors, application processors, microcontrollers, and network processors.

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Responsibilities:

• Lead product execution for Automotive/Consumer/Industrial ASIL-B/D SoC's

• Work with architects and systems engineering to define the part. Generate and analyze data to take right and cost-effective architecture decision.

• Work with IP, Technology, packaging partners to assess the right IP/packages and technology options for the part.

• Work with IP and SoC functions (front end, verification, AMS, DFT, Physical implementation) to understand and resolve inter/intra functional handoff and challenges.

• Oversee definition management and make sure the implementation complies with the requirements

• Work closely with downstream team's dependent on SOC, who are working on post-silicon activities, to make sure their needs are addressed

• Work closely with Test and Product engineering teams to enable productization.
• Work closely with post silicon evaluation teams (functional and analog Validation, Characterization, Application and Software teams) and address design issues.

• Work with Program management office for management attention and clearly articulate dependencies and help needed for timely execution of projects.

• Assess workload and resource demands based on complexity and create predictable project plans meeting customer requirements

• Mentor engineers across various functions

Cross functional aspects:

• This role is primarily about leading cross functional teams

• During part definition is includes a close interaction with Business, Systems, Architects, third party IP vendors

• During execution a close interaction and decision making is required between Technology, packaging, IP, Architecture, Various implementation functions, Test and Product Engineering.

• Post silicon, close collaboration is needed with Software, Test and production engineering, Application and Field teams.

• Overall, Chip lead is central design point of contact for all cross functional teams associated with the part.

Job Qualifications:

• Bachelor's in engineering with 15 years of design development experience, with at least 5 years of leading complete design and/or design functions.

• MS in Electrical Engineering preferred (higher level education may substitute for some experience).

• Experience in leading Global cross functional teams

• Experience in leading designs in smaller geometries desired