- Develop and maintain strong relationships and understanding of what technical solutions would enable our customers from an interconnect, packaging and cost-effectiveproduct solution.
- Drive development of technical solutions with SoC architects, silicon design, and product teams to recommend the optimum package solutions to meet electrical, mechanical, thermal, and other system level requirements. Introducing novel solutions at appropriate points to enable these solutions.
- Enable package design and assembly of advanced packages, through selection of materials, body sizes, tooling requirements, process capability evaluation and improvement, and package constructions to achieve acceptable Design for Manufacturing and High-Volume Manufacturing cost and efficiency requirements.
- Interface closely with Micron's internal manufacturing and external partners to productize advanced packaging solutions from concept to prototyping, testing and sample delivery to mass production phases.
- Support and collaborate with customers to ensure that Micron's products can meet their quality, reliability, system, and operational needs.
- An established network with peers in the industry and relationships with key stakeholders
- Proven ability to drive packaging roadmaps, engage vendors and suppliers and support business unit leaders in customer engagements.
- Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
- Experience and working knowledge with heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
- Experience with wafer bumping, wafer bonding, package assembly, substrate technology, BOM selection, testing and product development lifecycle.
- Strong publication record, patents, or contributions to industry standards are highly desirable.
- Demonstrated leadership experience in guiding cross-functional teams and driving technical excellence.
- Bachelor/Master of Science in materials, mechanical, chemical, or electrical engineering. MS or PhD preferred.
- 10+ years of relevant experience
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SMTS/DMTS, Advanced Packaging Architect - Boise, United States - Micron
Description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As anSenior Member of Technical Staff or Distinguished Member of Technical Staff in Advanced Packaging Technology Development, you will be a technical leader in Micron's Advanced Packaging strategy and drive technical innovation and engagementwith both internal and external customers to enable a best-in-class product roadmap enabled by innovative and industry leading memory and heterogenous integrated packaging solutions.
You will have the opportunity to collaborate with the industry leading technologists at partners engaged in advancing High Performance Computing and AI solutions that require memory and logic architectures and packaging technology that offers differentiated performance.
You will collaborate with Micron's world-wide talent that includefront end silicon development, product and system engineering, high volume manufacturing operations.
In this role, you will directly interact with senior executives on the technology which enables product plans and how to enable it. Together, we will be responsible for the definition, development, and delivery of state-of-the-art products that will advance compute and shape the future of this planet and beyond.
You must be comfortable and adept at dealing with uncertainty and find ways to identify and establish value, understand challenges and work across domain expertise, and across functions to convert challenges from "cannot do" to "can do", and conversations from "can do, but" to "and, can do" through analysis, developing a strategy, educating, garnering support and driving execution.
Responsibilities will include, but are not limited to:
Successful candidates for this position will have:
Required Experience:
As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on .
Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.
To learn about your
To learn more about Micron, please visit
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
