Sr. Manager Process Integration - Boise

Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments. · ...

Join our dynamic Process Integration team and contribute to the development and optimization of advanced semiconductor processes in a green field FAB environment. · ...

Lead Process Integration execution and readiness for assigned DRAM modules during tech transfer and early HVM Drive root‑cause investigations and yield improvement using DOE, SPC/FDC, FMEA, 8D, · and structured problem solving Ensure process margin manufacturability · and reliabi ...

We are seeking an exceptionally skilled Principal Engineer in DRAM R&D Process Integration (PI) to be part of a groundbreaking team in Boise. · ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · ...

As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. In this role you will lead Process Integration execution for advanced DRAM technologies during critical transfer pilot and early high‑volume manufacturing phase ...

Micron Technology is seeking a dynamic BEOL Process Integration Expert with proven experience in developing, transferring and optimizing advanced DRAM technologies. · ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, · inspiring the world to learn, communicate and advance faster than ever. · Lead technology integration activities in enabling manuf ...

+Lead technology integration activities in enabling manufacturability of state-of-the-art 3D DRAM technology · +Design and handle experiments in the R&D fab · +Optimize process flows and develop creative solutions to meet product requirements+Detailed knowledge of mainstream memo ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · Lead effective DRAM node transfers from TD or other HVM fabs to ID1 · Drive module-level process integration improvements for yiel ...

Micron Technology is seeking a Process Integration Conversion Coordinator in Fab 4 to support Process Integration Engineering. The role involves working closely with various teams to maintain critical process control systems and functions. · Submit and verify changes to setup in ...

Micron Technology is seeking a Process Integration Engineer to work on cutting-edge next-generation memories in an industry-leading 300mm R&D facility. · ...

We are seeking a Process Integration Conversion Coordinator to support our Fab 4 team in Boise, ID. As a key member of the Process Integration Engineering team, you will work closely with Change Management, Traveler Control, Manufacturing and Process Engineering teams to maintain ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. · Submit and verify changes to setup in GeRM, Sigma, SPACE, ...

Micron Technology is seeking an MTS Process Integration Engineer for its Advanced Packaging Technology Development (APTD) department. The ideal candidate will own the end-to-end integration of next generation package architectures like 2.5D, 3D stacking, HBM memory integration an ...

Micron Technology es una empresa líder en innovación de soluciones de memoria y almacenamiento que aceleran la transformación de información en inteligencia. · ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · ...

We are seeking a Staff Process Integration Engineer to join our Advanced Packaging Technology Development (APTD) team at Micron Technology. · ...

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. · ...

Own package-level process integration across 2.5D/3D flows wafer-to-wafer chip-to-wafer advanced interconnects defining specs and process windows that meet high performance targets for HPC/AI products · ...