Principal Microelectronic Packaging Mechanical Design Engineer or a Senior Principal Microelectronic Packaging Mechanical Design Engineer - Baltimore, United States - Northrop Grumman

Description

Northrop Grumman Mission Systems is seeking a PrincipalMicroelectronic Packaging Mechanical Design Engineer/ Senior PrincipalMicroelectronic Packaging Mechanical Design Engineer to join our team of qualified, diverse individuals. This position will be located in Baltimore, Maryland.

Overview:

You will work as part of a cross-functional team that is responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM, and communications systems, that are fielded on a multitude of airborne, marine, ground-based, and space military platforms. You'll support multiple projects spanning the product lifecycle, from R&D to full-rate production. Some example AESA products can be viewed at this website:

As an integral part of the Engineering and Sciences team, you will be responsible for the design and development of cutting-edge AESA antenna hardware that is featured in Northrop Grumman's world-class radar, ESM, and communications systems.

This position may be filled as a Principal Microelectronic Packaging Mechanical Design Engineer or a Senior Principal Microelectronic Packaging Mechanical Design Engineer.

Roles and Responsibilities include:

• Design, prototyping, and production support of state-of-the-art RF, digital, and mixed-signal multi-chip modules (MCMs), Printed Wiring Boards (PWBs), and Circuit Card Assemblies (CCAs) using various substrate materials and chip-scale packaging technologies
• Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management, and manufacturing.
• Organizing and prioritizing tasks to accomplish project milestones within schedule and budgetary constraints.
• Providing technical leadership and mentoring to less experienced personnel.

Basic Qualifications for Principal Microelectronic Packaging Mechanical Design Engineer:

• Bachelor's degree with 5 years of experience, a Master's degree with 3 years of experience or a PhD with 0 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
• U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
• Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
• Working knowledge of materials, specifications, manufacturing processes, and design tools utilized for multi-chip modules, PWBs, and CCAs
• Proficient with AutoCAD
• Familiarity with NX or other 3D modeling software

Basic Qualifications for Senior Principal Microelectronic Packaging Mechanical Design Engineer:

• Bachelor's degree with 9 years of experience, a Master's degree with 7 years of experience or a PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
• U.S Citizenship with the ability to obtain/maintain an active DoD Secret Clearance
• Experience with microelectronic packaging design, including chip-scale packaging technologies and substrate\PWB layout
• Working knowledge of materials, specifications, manufacturing processes and design tools utilized for multi-chip modules, PWBs and CCAs
• Proficient with AutoCAD
• Familiarity with NX or other 3D modeling software

Preferred Qualifications:

• Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields.
• Active DoD Secret Clearance or higher
• Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
• Familiarity with thermal and structural analysis considerations, methodologies, and software tools
• Experience with hands-on assembly and testing of prototype electronic hardware
• Experience in a technical leadership role on a cross-functional product development team

This position is contingent on the ability to obtain or maintain a US Secret Clearance or higher.