Director, Chiplets/FCBGA Integration - Tempe

Amkor is currently seeking a Director, Chiplets and FCBGA for our Tempe office. · The primary function of this position is program management for development of advanced chiplet-based IC Packages. · ...

This position manages key customer accounts for Advanced FCBGA Packaging in Tempe, AZ. · ...

Amkor is recruiting for a Business Unit (BU) Product Management position for Advanced FCBGA Packaging. · ...

Amkor is recruiting for a Director, Wafer Services Business Unit to be based at Amkor's corporate headquarters in Tempe, AZ. · This position will be a customer facing role and includes cross functional management with responsibility of wafer bumping, · wafers level CSP, · wafers ...

Amkor is recruiting for a Director, Wafer Services Business Unit to be based at Amkor's corporate headquarters in Tempe,AZ. · ...

This role leads the thermal system and application architecture for Direct‑to‑Chip (D2C) liquid cooling solutions used in AI and ML data centers. · Define and evaluate Direct-to-Chip liquid cooling architectures for AI/ML data centers · Understand and assess the complete thermal ...

onsemi is seeking a self-driven and motivated professional to join their Corporate Central Engineering modeling and simulation team. ...

We are seeking a technical expert to drive the design adoption of PowerLattice's chiplet-based power delivery network (PDN) solution. · This role sits at the intersection of deep technical expertise and customer engagement, · serving as a critical bridge between our internal desi ...

Job Summary: · As Product Engineer III for the Microsystems Business Unit, you will be specifically responsible for New Product Initiatives (NPI) launch and mature product sustainment activities that support Microsystems Custom package designs. You will proactively identify probl ...

Job Summary: · As Product Engineer III for the Microsystems Business Unit, you will be specifically responsible for New Product Initiatives (NPI) launch and mature product sustainment activities that support Microsystems Custom package designs. You will proactively identify probl ...

We are seeking a technical expert to drive the design adoption of PowerLattice's chiplet-based power delivery network (PDN) solution. · Enable customer to design GPU/CPU SoC power solution with PowerLattice's chiplet · Assist customer's PDN design optimization using PowerLattice' ...

We are seeking an experienced Senior Post-Silicon Validation Engineer to lead our silicon bring-up and validation.This hands-on role will own post-silicon evaluation of our leading-edge power delivery products from first silicon bring-up through production ramp. · ...

We are seeking an experienced Senior Analog Post-Silicon Validation Engineer to lead our silicon bring-up and validation. In this hands-on role you will own post-silicon evaluation of our leading-edge power delivery products from first silicon bring-up through production ramp. · ...

We are seeking a motivated and detail-oriented Senior or Staff level Analog Designer to join our engineering team.In this role, you will design and develop high-quality analog and mixed-signal integrated circuits,You will work closely with cross-functional teams to deliver robust ...

We offer all that and more at Microchip Technology Inc. · Define the requirements for Mixed-Signal IPs in discussion with the SoC architects · Collaborate with IP vendors to customize IP solutions and finalize Statement of Work (SOW) · ...

This role leads the thermal system and application architecture for Direct‑to‑Chip (D2C) liquid cooling solutions used in AI and ML data centersDefine and evaluate Direct-to-Chip liquid cooling architectures for AI/ML data centersEvaluate system-level trade-offs between thermal p ...

+This role leads the thermal system and application architecture for Direct-to-Chip (D2C) liquid cooling solutions used in AI and ML data centers.+ · +Understand and assess the complete thermal path: Chip, Package, TIM, Cold Plate, Coolant, CDU, Heat RejectionEvaluate system-leve ...

We are seeking an experienced Senior Post-Silicon Validation Engineer to lead our silicon bring-up and validation. · Bachelor's or Master's degree in Electrical Engineering, Computer Science or related field · 7+ years of hands-on post-silicon validation experience on analog or m ...

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportuni ...

Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division focused on next-generation semiconductor packaging solutions. · ...