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- As part of WW ASIC product development team, this individual will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost effective high performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements.
- 2.5D & 3D is cutting edge package technology with BRCM's needs pushing the technology limits.
- Job Scope (Advanced Package Technology Engineer)
- Provide deeper expertise in 2.
- Lead in identification, development & qualification; program management with external assembly partners
- Lead in memory supplier(s) engagement to define technology and quality requirements.
- Interface with other technical teams (DI, Pkg Design, Test Dev) etc.
- Support new design wins, NPI and volume ramps.
- Develop alternate sourcing & qualification.
- Basic: PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7~12 years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution.
- Specific: 4~6 years Hands On experience in 2.5D / 3D Development; In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.
- Others:
- Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems.
- Good team player with project management, analytical, problem solving and interpersonal skills.
- Hands on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc) for design optimization.
- Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations.
- Communicate extensively with internal and external team members, customers in various global locations and may require travel from time to time.
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Advanced Package Technology Engineer - Fort Collins, United States - Broadcom Corporation
Description
Please Note:
Job Description:
Job Description:
Compensation and Benefits
The annual base salary range for this position is $91,200 - $152,000
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time.
Broadcom is proud to be an equal opportunity employer.
We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.
We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Advanced Package Technology Engineer professionals in Fort Collins
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Kenneth Fletcher
Software Engineer