- High-Speed Digital (SERDES) and Radiofrequency Hardware Architecture
- Analyze state-of-the-art and future high-speed interconnect standards (Ethernet, PCIe, ) and identify Packaging and PCB design trade-offs (stackup, material selection, link budget SI/PI)
- Build High-Speed and RF use cases, reference designs and technology demonstrators to showcase Thintronics materials in product-compliant formfactors.
- PCB and Advanced Packaging Layout
- Generate Wiring Diagrams, Schematics and Layout designs using commercial ECAD tools (Altium, Cadence Allegro/APD, Siemens Xpedition).
- Document design rules and run DRC checks in collaboration with Susbtrate and PCB manufacturers.
- Additional responsibilities may include:
- Support the company's growth by coaching and mentoring junior engineers and scientists.
- Build and maintain internal relationships with Chemistry and ME/EE Modeling.
- Communicate Thintronics achievements and product roadmap to a larger audience through Trade Shows and Business Development events.
- Masters Degree or PhD in Electrical Engineering with emphasis on one or more of the following areas: High-Speed Digital Communications, RF Engineering, Antenna design, Photonics.
- 8+ years of experience in board-level design (architecture, schematic, layout and DFM).
- Track record of high-volume product shipment for consumer or infrastructure applications.
- Desirable: Experience with SI/PI and EM simulation tools such as Ansys EDT (HFSS, SiWave, Q3D)
- Competitive Bay Area salary
- Health Benefits
- Options/Equity
Senior/Lead Engineer - Berkeley, United States - Thintronics®
Description
SENIOR/LEAD ENGINEER – EE HARDWARE ARCHITECTURE
About Thintronics
More Data. Faster.
Global data volume traffic has been growing exponentially. The onset of AI applications is expected to make this worse. New insulator technology that enables higher frequency data transmission at lower power consumption is required to scale the AI infrastructure, starting with Data Center fabric. By synthesizing expertise in bottom-up Molecular Design, Computational Mechanics, and Electrical Engineering, Thintronics is unifying and optimizing the high-speed interconnect insulator, from silicon-to-system, enabling the highest data rates at the lowest power.
Thintronics is a start-up company located in Berkeley, CA. We are a team of chemists, materials scientists, and engineers shaping the future of data and devices. We offer an exciting start-up environment at the interface of R&D, machine learning-aided product design, scale-up manufacturing, and rapid market implementation.
Job Description
We are looking for a talented Packaging Process Integration Engineer to support Thintronics materials adoption in Advanced Semiconductor applications. This is a high-visibility/high-impact role with leadership growth potential.
The position responsibilities include:
Who We Want
We are seeking entrepreneurial people because here, your impact will matter. We want individuals who aren't afraid of hard work and new challenges, possess a "can-do" attitude, and can work independently as well as collaboratively.
We are looking for individuals who have the drive to excel. We will help empower you to do so.
Minimum Qualifications:
Compensation