Sr. Principal Engineer, Advanced Packaging - Austin

Join Marvell's central packaging organization responsible for enabling next‑generation connectivity and compute products. · Collaborate with IC design, physical layout, assembly engineering, and marketing to support package planning and substrate design. · ...

Lead the development of next-generation thermal technologies through rigorous model-based decision making. Create and apply thermal and multi-physics models to guide architecture definition, design trade-offs, and technology direction across thermal, electro-thermal, and electro- ...

The Role In this role, you will serve as a PCB-centric Mechanical Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). Join us as we sha ...

About Marvell · M arvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. · The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical, mechanical, ther ...

+Develop packaging technology roadmap for AI XPU XPU-attach Switch explore technologies beyond what is currently available make recommendations create protect IP to maximize performance Create new package technology concepts from open ended ideas perform routing feasibility signa ...

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. · ...

We are seeking a Senior Principal Engineer with deep expertise in advanced package technology to lead the development and optimization of advanced packaging solutions.About Marvell: · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure t ...

The role of Advanced Packaging Sourcing Manager at AMD involves coordinating the management and spend of strategic foundry suppliers with a focus on post-fab and advanced packaging services. This includes developing global procurement strategies, building supplier relationships, ...

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration... · ...

In this role, you will serve as a PCB-centric Mechanical Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). · Drive model-based archit ...

This role involves leading the development of next-generation thermal technologies through rigorous model-based decision making. · ...

The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions ...

About Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. · Develop packaging technology roadmap for AI XPU,XPU-attachand Switch · Create new package technology concepts from open ended ideas, · ...

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. · ...

Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. · ...

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. · ...

About Marvell · Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. · The Advanced Packaging R&D team is responsible for package design and technology development to meet electrical mechanical thermal system requ ...

This role involves developing packaging technology roadmaps for AI XPU, XPU-attach, and Switch.The ideal candidate will have experience in advanced package technologies with deep understanding of process materials component board level reliability warpage thermal management. · ...

The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions ...

The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet electrical mechanical thermal system requirements for next generation high performance computing HPC Artificial Intelligence AI networking solutions. · Develop packaging t ...